Chip heat sink package structure and making method thereof

Abstract

This invention relates to a chip heat sink packaging structure and its method of production, containing a substrate, a transistor core set on the substrate, a heat sink and a sealing gel material with the characteristic of the heat sink to be a sheet shape set on the said transistor core and be adhered together by the first heat conducting gel which is put on said substrate, transistor core and side radiating sheet. The production method is to cut the wafer to get the core chip to be adhered to a substrate by a heat conducting gel which will fix said core on said substrate after solidification then to be adhered and fixed by another heat conducting gel, and pulled with wire, adhered and welded with tin ball to finish the work to radiate the heat of the core to outside quickly due to the direct adhering of the radiator and the core.

Description

technical field [0001] The invention relates to a chip packaging structure and a manufacturing method thereof, in particular to a chip packaging structure including a heat dissipation device and a manufacturing method thereof. Background technique [0002] The continuous improvement and development of integrated circuits, the continuous reduction in volume, the continuous decline in prices, and the continuous improvement of functions, while improving functions, the core of integrated circuit work, the manufacturing process of semiconductor dies is becoming more and more rigorous and important; When the semiconductor die is working, the calculation and processing performed in such a small space will generate a relatively large amount of heat, and the generated heat must be dissipated in an appropriate way to avoid overheating of the integrated circuit chip Errors in calculation processing can cause damage to hardware circuits in severe cases. Therefore, the work of heat trea...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a chip heat dissipation packaging structure, which can solve the problems of implementation difficulties in the known technology and the need to increase the gap between the supporter and the die due to packaging problems, resulting in reduced heat dissipation and other deficiencies.

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