Inspection method utilizing vertical slice image

An inspection method and tomographic imaging technology, applied in the fields of wave/particle radiation, image enhancement, image analysis, etc., can solve problems such as omission

Inactive Publication Date: 2003-04-09
TERADYNE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since it is not feasible to examine each and

Method used

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  • Inspection method utilizing vertical slice image
  • Inspection method utilizing vertical slice image
  • Inspection method utilizing vertical slice image

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Embodiment Construction

[0024] Detailed description of the preferred embodiment

[0025] According to a preferred embodiment of the present invention, a method and apparatus for checking connections using vertical fault information is provided. The theory of tomography and the practice of tomography reconstruction have been well documented, with tomography it is possible to combine horizontal slices through an object in different focal planes. Those of ordinary skill in the art already know techniques and equipment for generating these horizontal tomographic images. In this regard, see US Patent Nos. 5,594,770, 5,097,492 and 4,688,241, the contents of which are incorporated herein by reference. It is important to point out that the terms "horizontal slice image" and "vertical slice image" are used herein to refer to data sets containing information about images, which may or may not actually be displayed.

[0026] figure 1 BGA joints are represented with multiple horizontal tomographic positions a...

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Abstract

An inspection method utilizing vertical slice imaging. A number of horizontal slice images, extending through an object of interest, are acquired. A vertical region of interest is defined from the data representing the horizontal slice images. A vertical slice image is constructed based upon the horizontal slice image data falling within the vertical region of interest. The vertical slice image data may be analyzed to detect defects. In addition, a method is provided to detect defects in a BGA joint. The method includes locating a center of the joint. The method may further include measuring a number of diameters through the center of the joint and applying a rule to compare the measured diameters to an expected diameter.

Description

[0001] related application [0002] This application is claimed in US Provisional Patent Application No. 60 / 163,932, filed November 8,1999. field of invention [0003] The present invention relates to printed circuit board inspection technology, and more particularly to a method and apparatus for inspecting interconnections on or within a circuit board using vertical tomography. Background of the invention [0004] The vast majority of electronic devices manufactured today include one or more printed circuit boards, also known as printed wiring boards. These printed circuit boards typically provide support for and interconnection of electronic components. Commonly used devices found on printed circuit boards are integrated circuits, usually made of semiconducting materials encapsulated in ceramic or plastic housings. The integrated circuit housing provides input and output (I / O) pins for mechanically and electrically connecting the integrated circuit semiconductor material...

Claims

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Application Information

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IPC IPC(8): G01B15/04G01N23/04G01R31/308G06T7/60H01L21/60H05K3/34
CPCG01B15/04G01N23/04G06T7/602G06T2207/30141G01R31/308G06T7/62G01N23/044
Inventor 罗希特·帕特奈克
Owner TERADYNE
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