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Method for manufacturing photoetching equipment and device

A lithography and projection device technology, applied in microlithography exposure equipment, opto-mechanical equipment, using optical devices, etc., to achieve the effect of maintaining vacuum and temperature

Inactive Publication Date: 2003-10-01
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These sensors also need to be insensitive to temperature fluctuations
[0021] It is an object of the present invention to provide an improved displacement measurement system for use in lithographic projection apparatus, in particular a system which solves or improves problems encountered with existing systems

Method used

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  • Method for manufacturing photoetching equipment and device
  • Method for manufacturing photoetching equipment and device
  • Method for manufacturing photoetching equipment and device

Examples

Experimental program
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Embodiment Construction

[0043] figure 1 A lithographic projection apparatus according to a specific embodiment of the present invention is schematically depicted. The device includes:

[0044] Radiation system Ex, IL, used to provide projected radiation (such as EUV radiation) beam PB, in this specific case, the system also includes a radiation source LA;

[0045] The first target stage (mask stage) MT is provided with a mask holder for fixing the mask MA (for example, a reticle), and is connected to a first positioning device for accurately positioning the mask relative to the part PL;

[0046] The second target stage (substrate stage) WT is provided with a substrate holder for fixing the substrate W (for example, a silicon wafer coated with a resist), and is connected to a second positioning device for accurately positioning the substrate with the relevant part PL On PW;

[0047] The projection system PL (for example, a mirror array group) is used to image the radiation part of the mask MA on the targ...

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PUM

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Abstract

The invention relates to a displacement measurement system for measuring the position of an optical element in a projection system of a lithographic projection device. The displacement measurement system utilizes the principle of interferometry, including the use of a first diffraction grating mounted on an optical element and a second diffraction grating mounted on a reference frame.

Description

Technical field [0001] The present invention relates to a lithographic projection device, including: [0002] A radiation system used to provide projected radiation beams; [0003] A supporting structure for supporting a patterning device, wherein the patterning device is used to pattern the projected beam according to a desired pattern; [0004] A substrate table used to hold a substrate; and [0005] A projection system for projecting a patterned beam on a target portion of the substrate, including at least one optical element; and [0006] A displacement measurement system for measuring the position of the at least one optical element. Background technique [0007] The term "patterning device" as used herein should be broadly understood as referring to a device capable of making the incident radiation beam have a patterned cross-section, where the patterned cross-section is equivalent to the pattern to be produced on the target portion of the substrate; the term "light valve" ...

Claims

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Application Information

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IPC IPC(8): G01B11/00G01D5/38G02B5/18G03F7/20G03F9/00H01L21/027
CPCG01D5/38G03F7/70258G03F7/70833G03F7/709H01L21/027
Inventor M·拉文斯伯根
Owner ASML NETHERLANDS BV