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Thermosetting resin composition and semiconductor device obtained therefrom

A resin composition, thermosetting technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as low production efficiency

Inactive Publication Date: 2003-12-03
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with this semiconductor production method is that the production efficiency is low due to the many steps involved

Method used

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  • Thermosetting resin composition and semiconductor device obtained therefrom
  • Thermosetting resin composition and semiconductor device obtained therefrom
  • Thermosetting resin composition and semiconductor device obtained therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 4 and comparative example 1 and 2

[0123] The components given in Table 2 were mixed together at 80° C. according to the individual recipes given in this table by means of a universal mixing tank. The resulting mixture was filtered through a 400-mesh filter, and then degassed under vacuum for 30 minutes, thereby producing a target epoxy resin composition for semiconductor sealing. The exothermic peak temperature due to the reaction of each thermosetting resin composition obtained was measured with a differential scanning calorimeter (PyTisl, manufactured by Perkin-Elmer Corp.) in the above-mentioned manner at a heating rate of 10°C / min.

[0124] The thermosetting resin compositions thus obtained in Examples and Comparative Examples were subjected to a solder wetting test. In this test, each thermosetting resin composition 7 was applied to a preflux-coated copper plate 5 that had been surface-treated with a preflux (preflux) (WLF16, manufactured by Tamura kalen), as Figure 4 shown, and place the copper plate o...

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Abstract

A thermosetting resin composition which contains: (A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general formula (1) or (2); and (D) a microcapsule type hardening accelerator containing microcapsules each having a structure made up of a core containing a hardening accelerator and a shell covering the core and containing a polymer having a structural unit represented by the following general formula (3), and which, when examined by differential scanning calorimetry at a heating rate of 10 DEG C / min, shows an exothermic peak due to reaction in the range of from 180 to 250 DEG C, and a semiconductor device obtained through sealing with the composition are described.

Description

technical field [0001] The present invention relates to a thermosetting resin composition used for sealing to fill a gap between a wiring board and a semiconductor element in the production of a semiconductor device, and to a semiconductor device obtained by sealing with the thermosetting resin composition. Background technique [0002] For recent improvements in semiconductor devices, techniques for mounting semiconductor elements on wiring boards to form downward-facing structures (such as flip chip method or direct die attach method) are required. The flip-chip method has reliability problems related to connection parts because semiconductor elements and wiring boards having different coefficients of linear expansion from each other are directly electrically connected to each other. One technique used as a solution to this problem involves filling the gap between the semiconductor element and the wiring board with a liquid resin material and curing the material to form a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/18H01L21/56H01L23/29
CPCH01L2224/29007H01L2224/83192C08G59/188H01L2924/01079H01L2224/73204H01L2924/01025H01L21/563H01L23/293Y10T428/12528Y10T428/31511C08L63/00
Inventor 野吕弘司襖田光昭
Owner NITTO DENKO CORP