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Substrate processing method, substrate processing apparatus and substrate processing system

A substrate processing method and technology for a substrate processing device are applied in the directions of cleaning methods and appliances, chemical instruments and methods, cleaning methods using liquids, etc., and can solve the problem of large-scale substrate processing devices, restricting the selection range of processing liquids, and restricting the selection of processing liquids. Scope and other issues, to achieve the effect of reduced device cost, superior versatility, and excellent versatility

Inactive Publication Date: 2004-06-02
DAINIPPON SCREEN MTG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, a substrate processing apparatus equipped with dedicated transport units (automatic transport device for alkaline development and automatic transport device for organic development) corresponding to such development processing will lead to an increase in the size and cost of the substrate processing apparatus.
[0013] On the other hand, the device for continuously performing wet processing and high-pressure drying processing in one reaction tank described in Patent Document 2 has the following problems. Substrate processing equipment for surface treatment at normal pressure has many constraints
One of the biggest constraints is the limited range of treatment fluid selection
As mentioned above, it is necessary to use a pressure vessel as a reaction tank in this substrate processing apparatus. However, when a strong acid or alkali corrosive treatment liquid is used for surface treatment, the treatment liquid will corrode the liquid contact surface of the pressure vessel.
Therefore, in order to implement surface treatment, strong acid or strong alkaline corrosion solution cannot be introduced, and the result is that the selection range of treatment solution is greatly restricted.
[0014] In order to eliminate the above restrictions, it is of course conceivable to make the inner surface of the pressure vessel with a corrosion-resistant coating such as fluororesin, but it is actually difficult to continue to perform its function under high pressure for a long time

Method used

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  • Substrate processing method, substrate processing apparatus and substrate processing system
  • Substrate processing method, substrate processing apparatus and substrate processing system
  • Substrate processing method, substrate processing apparatus and substrate processing system

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Experimental program
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Embodiment approach 1

[0050] figure 1 It is a figure which shows Embodiment 1 of the substrate processing system of this invention. figure 2 yes means figure 1 A diagram of the imaging processing unit equipped in the substrate processing system. image 3 yes means figure 1 A diagram of the high-pressure drying unit equipped with the substrate processing system. This substrate handling system as figure 1 As shown, a substrate processing part PS and a delivery part (Indexa part) ID coupled to the substrate processing part PS are provided.

[0051] In the substrate processing section PS, a plurality of development processing units (two development processing units 10A, 10B in the present embodiment) that perform the same wet processing process on the substrate are provided, as "wet processing device" and "substrate processing unit". device" and "wet processing unit". That is, each of the developing processing units 10A, 10B first supplies the developing solution as the first developing solution...

Embodiment approach 2

[0084] Figure 6 Embodiment 2 of this invention concerning a substrate processing system is shown. Embodiment 2 has a big difference from Embodiment 1. The development processing units 10A and 10B provided in the substrate processing section PS are different from the development processing units that perform the same wet processing process on the substrate in Embodiment 1. Reference numeral 2 is a development processing unit that performs development processing different from each other. The basic configurations of the image development processing units 10A, 10B are the same as those in Embodiment 1, and only the developer and rinse liquid used are different. In the following, the same structure is denoted by the same symbol, the description is omitted, and only the difference will be described.

[0085] In the development processing units 10A and 10B, a common replacement liquid is supplied from the drying preventing liquid supply source 158 regardless of the development pr...

Embodiment approach 3

[0107] Figure 8 Embodiment 3 concerning the substrate processing system of this invention is shown. Figure 9 express Figure 8 The imaging unit of the substrate processing system setup shown. and Figure 10 express Figure 8 Replacement unit for substrate handling system setup shown. This Embodiment 3 is very different from Embodiment 1. The difference lies in that the development processing, flushing processing, and replacement processing in the developing units 10A and 10B of Embodiment 1 are carried out in the same device, while in Embodiment 3 , the developing process and the developing process are carried out in the developing unit 10C, and the replacement process is carried out by the dedicated replacement unit 70 . The main automatic transport device 30 wet transports the substrate W from the developing unit 10C to the supercritical drying unit 20 via the replacement unit 70 . Other configurations are basically the same as those in Embodiment 1. Therefore, the ...

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Abstract

Substrate processing method, substrate processing apparatus and substrate processing system, to efficiently carry out a series of treatments from a wet treatment to a dry treatment without damaging a substrate. In a development unit 10A and 10B, a development treatment, rinsing, and a permutation treatment are conducted in this order on a substrate W. Thereafter, the substrate W which is wet with a drying prevention liquid is wet-transferred to a super-critical drying unit 20 by means of a main transfer robot 30. In the super-critical drying unit 20, high-pressure drying (super-critical drying) which is a technical treatment is carried out. Consequently, without putting any limitations to the kind of a developer to be used in the development treatment and without causing such problems as the corrosion in a pressure vessel 202 of the super-critical drying unit 20, a series of processes from the development treatment to the high-pressure drying treatment are carried out. Due to the existence of the drying prevention liquid, the substrate W is kept from natural drying during transportation.

Description

technical field [0001] The present invention relates to a method for carrying out a process from a predetermined wet process to a drying process for various substrates (hereinafter referred to as substrates) such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, and substrates for optical discs. A substrate processing method for processing a series of processes, and a substrate processing apparatus and a substrate processing system applicable to the method. Background technique [0002] The miniaturization of semiconductor devices has progressed rapidly in recent years, but with this miniaturization, new problems have arisen in substrate processing. For example, when forming fine patterns by patterning a protective film coated on a substrate, sequential wet processing Development processing and drying processing. The wet developing treatment in which the protective film coated on the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B7/26H01L21/00
CPCH01L21/67028G11B7/261G11B7/265H01L21/67051Y10S134/902
Inventor 村冈祐介齐藤公续岩田智巳深津英司溝端一国雄上野博之奥山靖夫蒲隆坂下由彦渡边克充宗政淳大柴久典猿丸正悟
Owner DAINIPPON SCREEN MTG CO LTD