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Semiconductor memory device

A technology for memory devices and semiconductors, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, static memory, etc., and can solve problems such as increasing the layout area.

Inactive Publication Date: 2004-08-25
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, even for the selection line for selecting the duplication unit 909, the wiring area must be re-determined
The result is an increased layout area

Method used

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  • Semiconductor memory device
  • Semiconductor memory device
  • Semiconductor memory device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0045] figure 1 It is a functional block diagram showing a configuration example of the semiconductor memory device according to the first embodiment of the present invention. exist figure 1 Among them, the semiconductor memory device of the present embodiment has: a memory array 100 comprising a plurality of memory cells 106; a row decoder (rowdecoder) 101 connected to the memory array 100; a sense amplifier circuit 103, which amplifies the selected memory cell 106 reads data on bit lines BL, BB; replica circuit 104A; and sense amplifier control circuit 105 supplies sense amplifier enable signal SAE to sense amplifier circuit 103 .

[0046] The composition of replica circuit 104 is as follows: a plurality of replica units 109A-1, 109A-2, 109A-3, 109A-4 (hereinafter collectively referred to as 109A), have the same elements as memory cell 106, are driven by dummy bit line 115, The signal of the level corresponding to the number of stages is output to the shared replica bit li...

no. 2 Embodiment

[0053] figure 2 It is a functional block diagram showing a configuration example of a replica circuit in the semiconductor memory device according to the second embodiment of the present invention. exist figure 2 Among them, the replication circuit 104B of this embodiment is composed of replication units 109B-1, 109B-2, 109B-3, 109B-4 (hereinafter collectively referred to as 109B) and switch circuits 110B-1, 110B-2 (hereinafter collectively referred to as 110B) .

[0054] When replica cells are selected in the same manner as in the first embodiment, the current flowing through the switching circuit may be limited, resulting in a smaller current than originally intended. In order to avoid this problem, switch circuits 110B-1, 110B-2 are provided on different power supply lines, respectively. Therefore, the current is no longer restricted by flowing through the switching circuit 110B.

[0055] As mentioned above, according to this embodiment, since the switch circuit 110 i...

no. 3 Embodiment

[0057] image 3 It is a functional block diagram showing a configuration example of a replica circuit in the semiconductor memory device according to the third embodiment of the present invention. exist image 3 Among them, the replication circuit 104C of this embodiment consists of replication units 109C-1, 109C-2, 109C-3, 109C-4 (hereinafter collectively referred to as 109C) and switch circuits 110C-1, 110C-2 (hereinafter collectively referred to as 110C).

[0058] In order to optimize the start-up timing of the sense amplifier, it is necessary to perform fine adjustment from the potential pulled out to the target bit line. In addition, when replica cells are selected in the same manner as in the first embodiment, the current value may be limited by the switching circuit, resulting in a smaller current than originally intended. In order to avoid this problem, by providing a plurality of switch circuits 110C-1 and 110C-2 on one power supply line, it is possible to limit the...

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Abstract

A semiconductor memory device includes a replica circuit including a plurality of replica cells (RMC) having the same elements as those of memory cells in a memory array and outputting signals with levels in accordance with the stage number to a common replica bit line, and a sense amplifier control circuit for receiving a signal of the replica bit line to control a timing of a signal SAE for starting a sense amplifier circuit. The replica circuit includes a switching circuit (SW) for switching the stage number of the replica cells to be activated among the plurality of replica cells in a programmable manner.

Description

technical field [0001] The present invention relates to a semiconductor memory device which generates an activation timing signal of a sense amplifier circuit using a replica circuit including replica cells having the same structure as memory cells contained in a memory array. Background technique [0002] In conventional semiconductor memory devices, a method of generating a timing signal of a sense amplifier for amplifying read data from a memory cell to track the read timing of the memory cell to variations caused by processes and voltages is often employed. Among them, there is a method of programmably changing a timing signal using a replica circuit. This method will be described below. [0003] FIG. 11 is a functional block diagram showing an example of the structure of a conventional semiconductor memory device (see US Patent No. 6,172,925). In FIG. 11 , the existing semiconductor storage device has: a storage array of SRAM (hereinafter referred to as storage array)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/419G11C7/10G11C7/22G11C11/413H01L21/8244H01L27/11
CPCG11C2207/2281G11C7/1045G11C7/227G11C7/22G11C5/063G11C7/08G11C11/412G11C11/417
Inventor 大槻浩久铃木利一
Owner PANASONIC CORP
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