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Microstructure mold core making technology

A microstructure and microstructure technology, applied in microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve problems such as inability to process microstructures, achieve high yield, overcome dimensional accuracy, and low cost.

Inactive Publication Date: 2004-09-08
U TECH MEDIA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, products have gradually become miniaturized, and traditional mechanical processing has been unable to process fine structures below the micron level.

Method used

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  • Microstructure mold core making technology
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  • Microstructure mold core making technology

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Embodiment Construction

[0014] see figure 1 , figure 1 It is a schematic cross-sectional view of the metal bonding technology of the present invention. In the process of mold core production, the most important thing is to consider the impact of future product molding and the subsequent effect, so as not to affect the quality of the microstructure of the finished product. Therefore, it must be pressurized to maintain the flatness of the surface of the mold core. However, the general pressure method is easy to damage the surface microstructure of the metal sheet. like figure 1 As shown, the metal bonding technique used in the present invention is to first electroplate the copper metal layer 14 on the surface of the metal thin plate 10, such as a nickel plate, and the mold core 12, and then fill the two copper metal layers 14 with indium (In) or The intermediate bonding layer 16 of the indium alloy is heated to 200 to 400° C. and pressurized to 300 to 400 kg / cm 2 The two metal layers 14 are adhere...

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Abstract

The microstructure mold core making technology is applied in the duplication formation of plastic and metal products with microstructure, and includes one mold structure and at least one mold core assembly with microstructure or duplicated pattern set inside the mold. The mold core assembly includes one mold core body and one connected metal sheet with microstructure. The microstructure is first transferred to the metal sheet via yellow light microphotograph and electroforming, and the metal sheet is then jointed with the mold core for large-scale duplication production. The said technological process can make complicated pattern or multiple mold structure on one transferring plate to raise the production efficiency greatly. The present invention is one combination of available apparatus and future technology.

Description

technical field [0001] The present invention relates to a mold core manufacturing technology with microstructure or replica pattern and its mold structure, in particular to a microstructure mold core manufacturing technology and its mold structure with high yield, high production efficiency and low cost. The advantages of the present invention lie in that the processing time and cost of the mold core can be greatly reduced, and the limit of the dimensional accuracy of mechanical precision processing can be overcome. The invention transfers the microstructure to the metal sheet by electroforming through the yellow light lithography process, and then joins the metal sheet with the mold core, which can be used in mass reproduction production, such as optical discs or biochips with microstructures. In addition, through the yellow light fabrication process, complex micro-patterns or multi-mode structures can be produced on a stamper, and the actual production efficiency of one mold...

Claims

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Application Information

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IPC IPC(8): B81C1/00
Inventor 周天佑赖志辉陈怡礽巫诺文林彦亨廖俊郎颜国雄张世慧
Owner U TECH MEDIA
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