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Semiconductor storage device

A storage device and semiconductor technology, applied in semiconductor devices, information storage, semiconductor/solid-state device manufacturing, etc., can solve the problem of increasing the cost of aging devices, increasing the chip area of ​​flash EEPROM devices 110, increasing the cost of testing chips for flash EEPROM devices, etc. question

Inactive Publication Date: 2004-10-20
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] However, in the above-mentioned conventional example 2, in addition to the word line potential measurement circuit 112 and the bit line potential measurement circuit 113, a bit line selection transistor BST is provided. 1 ~BST n and the word line select transistor WSR 1 ~WST m Signal lines and control circuits controlled one by one, thus significantly increasing the chip area of ​​the flash EEPROM device 110
And in the burn-in device 200, in order to judge the potential of the word line and the potential of the bit line, it is also necessary to set the comparator 201 of the number of flash memory EEPROM devices that will be tested uniformly, and the required cost of the burn-in device has also increased.
[0026] Like this, in above-mentioned existing flash memory EEPROM device, if will certainly carry out interference test, just there is the problem of increasing the chip cost of flash memory EEPROM device and test expense

Method used

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  • Semiconductor storage device
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Examples

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Embodiment 1

[0087] Embodiment 1 of the present invention will be described with reference to the drawings.

[0088] figure 1 A block diagram showing the configuration of the semiconductor memory device according to Embodiment 1 of the present invention. Such as figure 1 As shown, the semiconductor storage device of Embodiment 1 is equipped with a memory cell array 10 in which a plurality of memory cells are arranged in rows and columns. Apply a stress voltage to the sample region 12. Furthermore, as a peripheral circuit for driving the memory cell array 10, a word line driver 13 for driving the word line of the memory cell region 11 and the word line of the sample region 12 (hereinafter referred to as a sample word line) is provided; and a bit line driver 14 for the bit line of the sample region 12 (hereinafter referred to as a sample bit line); and a source line driver 15 for driving a common source line of the memory element region 11 and the sample region 12 .

[0089] Here, the ...

Embodiment 2

[0139] Hereinafter, a semiconductor memory device according to Embodiment 2 of the present invention will be described with reference to the drawings.

[0140] The configuration block diagram of the semiconductor memory device of Embodiment 2 and figure 1 Similarly, the difference from Embodiment 1 lies in that: in the memory cell array 10 , a switching device is provided to isolate the connection between the memory cell region 11 and the sample cell region 12 .

[0141] Figure 8 The circuit configuration of the memory cell array of the semiconductor memory device according to the second embodiment is shown. like Figure 8 As shown, in the memory cell array 10, as a switch device for controlling the connection between the memory cell region 11 and the sample cell region 12, sample cells SCW respectively connected to the word lines are provided. 11 ~SCW m1 with memory cell MC 1n ~MC mn The fuse FW between each control gate electrode 1 ~FW m , and set the sample cell S...

Embodiment 3

[0157] Hereinafter, a semiconductor memory device according to Embodiment 3 of the present invention will be described with reference to the drawings.

[0158] Figure 10 A block diagram showing the semiconductor memory device of the third embodiment. like Figure 10 As shown, averaging circuit 32 is provided on bit line driver 14 by intervening readout circuit 31 . In addition, the readout circuit 31 is a control circuit that performs a readout operation as described in the first embodiment.

[0159] The feature of the semiconductor storage device of Embodiment 3 is: in the sample cell region 12 of the memory cell array 10, a plurality of sample cells are respectively arranged on one bit line or one word line, and in the averaging circuit 32, a plurality of sample cells The amount of change in threshold voltage of the cells is averaged and read out.

[0160] Figure 11 It is a circuit diagram showing a memory cell array of the semiconductor memory device of the third emb...

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PUM

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Abstract

Provided is a means for determining whether the stress as prescribed is exerted or not at the disturbance test for a semiconductor storage device, at a low cost and without increasing the area of a chip. A memory cell array includes a memory cell area 11 consisting of memory cells MC<11>to MCand a sample cell area 12 consisting of word line sample cells SCW<11>to SCWand bit line sample cells SCB<11>to SCB<1n>, wherein the word line sample cells SCW<11>to SCWand the bit line sample cells SCB<11>to SCB<1n>are formed so that electric charges are easily movable from floating gate electrodes in accordance with voltages applied to word lines WL<1>to WLand bit lines BL<1>to BL, as compared with the memory cells MC<11>to MC.

Description

technical field [0001] The present invention relates to a semiconductor memory device having an electrically rewritable nonvolatile memory cell, and more particularly to a semiconductor memory device corresponding to an inspection method for inspecting nonvolatile memory cells using an aging process. Background technique [0002] Conventionally, as a semiconductor storage device that stores data in elements integrated on a semiconductor substrate, a nonvolatile semiconductor storage device capable of retaining data even when power supply is stopped has been used. In particular, electrically rewritable and electrically erasable flash memory EEPROM devices having a floating gate electrode whose periphery is insulated by an oxide film and a control gate electrode formed by interposing a capacitive insulating film on the floating gate electrode are widely used. [0003] (existing example 1) [0004] Figure 17 Shown is a block diagram of the configuration of the flash EEPROM de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G11C7/00G11C11/00G11C16/02G11C16/04G11C29/00G11C29/06G11C29/12G11C29/56H01L21/8247H01L27/115H01L29/788H01L29/792
CPCG11C16/0416G11C16/04G11C29/12G11C2029/4402G11C2029/5004
Inventor 椋木敏夫杉本映小关隆夫
Owner PANASONIC CORP
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