Thermosol of polyamide and preparation process thereof

A polyamide hot-melt adhesive and caprolactam technology, which is applied in the direction of adhesives, etc., can solve the problems that cannot meet the requirements of high-temperature occasions, the melting point of hot-melt adhesive is low, and the amount of component c is large, and achieves high flexibility, low cost, and simple process. Effect

Active Publication Date: 2005-03-23
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The amount of component c in the hot melt adhesive is relatively large, and the cost of the product is relatively high
Moreover, the melting point of the hot-melt adhesive is low, an

Method used

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  • Thermosol of polyamide and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Caprolactam, nylon 66 salt, piperazine, C 12Put the dibasic acid into the polycondensation reactor with stirring in the weight ratio of 41.0:53.0:1.4:4.0, replace with nitrogen, heat the material in the reactor to 250°C, and keep the reaction pressure at 1.6MPa for 2.5h. Then at this temperature, the reaction pressure was reduced to normal pressure, the depressurization time was 2.5 hours, the reaction temperature was kept constant, and the reaction was continued for 1.8 hours before the polycondensation ended. The stirring speed of the whole polycondensation reaction process is 50r / min. After discharging, cooling, and slicing, the obtained product is a light yellow translucent solid slice with a melting point range of 178°C to 185°C and a melt index of 17.2g / 10min (240°C, 0.216MPa).

Embodiment 2

[0031] According to the method of embodiment 1, the weight ratio of each polymerization monomer material is caprolactam: adipic acid: hexamethylenediamine: C 10 ~C 15 Mixed dicarboxylic acid trimethylhexamethylene diamine salt = 22.0: 26.6: 21.2: 13.0, where C 10 ~C 15 The composition of mixed dicarboxylic acids is C 10 Dicarboxylic acid 0.8wt%, C 11 Dicarboxylic acid 3.2wt%, C 12 Dicarboxylic acid 26.1wt%, C 13 Dicarboxylic acid 51.4wt%, C 14 Dicarboxylic acid 17.4wt%, C 15 Dicarboxylic acid 1.1 wt%. The pressure polycondensation reaction conditions are: temperature 260°C, pressure 1.6MPa, reaction time 2.0h, depressurization time 2.0h. The normal compression polymerization conditions are: the reaction temperature is 260°C, the reaction time is 2.0h, and the stirring speed is 80r / min during the reaction process. The melting point range of the obtained product is 163-169° C., and the melt index is 35.9 g / 10 min (240° C., 0.216 MPa).

Embodiment 3

[0033] According to the method of embodiment 1, the weight proportion of each polymerization monomer material is caprolactam: adipic acid: decanedidiamine: C 10 ~C 15 Mixed dicarboxylic acid butanediamine salt = 30.0: 26.6: 31.4: 12.0, where C 10 ~C 15 The composition of mixed dicarboxylic acids is C 10 Dicarboxylic acid 0.8wt%, C 11 Dicarboxylic acid 3.2wt%, C 12 Dicarboxylic acid 26.1wt%, C 13 Dicarboxylic acid 51.4wt%, C 14 Dicarboxylic acid 17.4wt%, C 15 Dicarboxylic acid 1.1 wt%. The pressure polycondensation reaction conditions are: temperature 260°C, pressure 1.6MPa, reaction time 2.0h, depressurization time 2.0h. The normal compression polymerization conditions are: the reaction temperature is 260°C, the reaction time is 2.0h, and the stirring speed is 70r / min during the reaction process. The melting point range of the product obtained by the polycondensation reaction is 161-167°C, and the melt index is 36.4g / 10min (240°C, 0.216MPa).

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Abstract

The invention discloses a polyamide thermosol, containing the following copolymer monomers: A. one or many kinds of hexanolactam, amino-caproic acid, 11-aminoundeeanic acid and laurolactam; B. one or many kinds of mixtures formed of C4-C9 aliphatic dicarboxylic acid and equivalent C2-C12 aliphatic diamine or their nylon salts; C. one or many kinds of mixtures formed of C10-C15 long-carbon chain aliphatic dicarboxylic acid and equivalent C4-C12 diamine or vinyl-amine or their nylon salts. It has high melting point, narrow fusing temperature range, high bonding strength, good low-temperature flexibility and high-temperature resistance, and can be applied to binding metal material, metal-plastic laminated composite, and car light.

Description

technical field [0001] The invention relates to a hot-melt adhesive and a preparation method thereof, in particular to a high-temperature nylon polyamide melt adhesive and a preparation method thereof. Background technique [0002] Polyamide hot melt adhesive is a kind of widely used hot melt adhesive. It is a multi-component copolymer obtained by polycondensation reaction of two or more monomers in a certain proportion. Polyamide hot-melt adhesive has high bonding strength, good thermal stability, good medium resistance, good bonding performance to wood, metal, ceramics, fabric, paper, phenolic resin, polyethylene, etc., and its excellent The comprehensive performance is called high-grade hot melt adhesive. [0003] High-temperature hot-melt adhesives are generally used under high-temperature conditions, which requires the hot-melt adhesive to have a higher melting point and maintain a higher bonding strength under high-temperature conditions. To maintain good flexibility...

Claims

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Application Information

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IPC IPC(8): C09J177/06
Inventor 王崇晖高大成张艳丽宋喜军
Owner CHINA PETROLEUM & CHEM CORP
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