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Method for the production of contact pads on a substrate and device for carrying out said method

A technology of electric contact welding and process, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of time-consuming processing methods, difficulties, and expensive implementation

Inactive Publication Date: 2005-08-03
APPLIED MICROTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is a time-consuming process and requires a large number of operations, making it expensive and difficult to implement

Method used

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  • Method for the production of contact pads on a substrate and device for carrying out said method
  • Method for the production of contact pads on a substrate and device for carrying out said method
  • Method for the production of contact pads on a substrate and device for carrying out said method

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Embodiment Construction

[0030] Figures 1 to 3 The different steps in a process according to the invention for producing at least one electrical contact pad 1 on a carrier area 2 of an electronic component 3 are illustrated.

[0031] The electronic component 3 is made of any material known to a person skilled in the art and comprises a conductive carrying area 2, for example usually consisting of a metal track of copper or gold.

[0032] In the process according to the invention, at least one channel 5 is injected with a liquid alloy or metal 4 .

[0033] Among the alloys usable in the process according to the present invention, alloys combining two or more of the elements Sn, Pb, Bi, and In may be cited by way of non-limiting illustration only.

[0034] The channel 5 comprises two parts 5A and 5B, namely a feed part 5A and a molding part 5B, which are separated by a constriction 5C.

[0035] Figures 1 to 4 A process and apparatus is shown using 4 lanes for illustration purposes only. In practice...

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Abstract

Production or regeneration of electrical contact pads (1) on a land (receiving pad) (2) of an electrical component involves injecting molten metal (4) into a conduit (5) having routing (5A) and molding (5B) parts and onto the land (2); and separating the molding part and the land (2) before complete solidification of the metal, while maintaining attachment of routing and molding parts. Production of at least one electrical contact pad (1) on a land (receiving pad) (2) of an electrical component or regeneration of an assembly of electrical contact pads (1) produced on a land (2) of an electrical component involves: (a) injecting a molten alloy or metal (4) into at least one conduit having a routing part (5A) and a molding part (5B) and positioned such that the molding part (5B) emerges onto the land (2); and (b) separating the molding part (5B) and the land (2) before complete solidification of the metal or alloy, while maintaining attachment of the routing part (5A) and molding part (5B). The routing part (5A) is part of a first component forming a die (6), and the molding part (5B) is part of a distinct second piece forming a mold (7). The die (6) and the mold (7) are juxtaposed to form the conduit (5). An Independent claim is given for a device used for implementation of the above process.

Description

technical field [0001] The present invention relates to the technical field of manufacturing electrical connection pads (eg balls) on the surface of electronic components. [0002] More specifically, the invention relates to a process for producing at least one electrical contact pad on a receiving zone of an electronic component, in which process at least one channel is injected with a liquid alloy or metal, said channel comprising Two parts: a feed portion separated by narrowing and a molding portion, the channel being arranged so that the molding portion opens on the carrying area. [0003] The invention also relates to a device for producing at least one electrical contact pad on a carrier area of ​​an electronic component, said device comprising a channel for transporting a liquid alloy or metal, said channel itself comprising two parts: a feed part, It is part of a first part forming a die; and a molding part is part of a second part forming a mold, the feed part and mo...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/60H05K3/34
CPCH05K2203/128H01L2224/1131H05K3/3468H01L2924/01082H01L21/4853H01L2924/01079H05K2203/0113H01L2924/14H01L2924/01005H01L2924/01033H01L2924/01029H01L2224/13099H01L2924/01057H01L2924/01058H01L24/11H01L2924/01087H01L2924/01013H01L2924/014H01L2224/05571H01L2224/05573
Inventor 埃里克·弗朗索瓦·派拉特费代里克·吉恩·瓦龙
Owner APPLIED MICROTECH
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