Heat pipe and manufacturing method therefor

Abstract

Disclosed is a heat pipe which comprises a first substrate including at least a first short fim slice and at least a first long fim slice and a second substrate including at least a second short fim slice and at least a second long fim slice, wherein, plough grooves between adjacent short and long fim slices form flowage channels for operating fluids, the first and the second long fim slices are respectively connected with corresponding plough grooves on the second substrate and the first substrate, and the long fim slices are connected with the corresponding plough grooves through welding manner.The method for fabricating the heat pipe comprises 1) providing a flat plate which includes a substrate and a short and a long fim slices arranged on the substrate, with plough grooves formed between the short and the long fim slices; 2) buckling a first part of the flat plate towards a second part of the flat plate to contact the long fim slices on the first part and the second part respectively with the corresponding plough grooves on the second part and the first part; 3) connecting the long fim slice with the corresponding plough groove through welding manner; and 4) sealing the two terminal parts of the flat plate.

Description

【Technical field】 [0001] The invention relates to a heat pipe and a manufacturing method thereof, in particular to a micro-grooved heat pipe and a manufacturing method thereof. 【Background technique】 [0002] In the industrial production process, various parts and components will generate heat during operation. For example, in the electronic information industry, computer components will generate a lot of heat during work. Various electronic components, integrated circuits, especially the central processing unit, will generate a lot of heat during the working process. If the heat generated is not removed in time, the heat will accumulate and cause the temperature to rise, which will seriously affect the operation of electronic components. For example, a Pentium processor including millions of transistors, if the heat generated during its operation cannot be removed in time, these transistors are more likely to damage the processor due to overheating, and even damage other co...

AI Technical Summary

Problems solved by technology

Such as the above two methods of processing micro heat pipes, it is very easy to form protrusions on the two parts of the flat heat pipes in the process of manufacturing micro heat pipes, thereby reducing the heat conduction efficiency between the heat pipes and heating elements; When the vapor pressure inside is high, the two parts of the heat pipe will separate from each other due to expansion, which will affect the heat dissipation performance of the heat pipe

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