Bulk silicon mirrors with hinges underneath

A hinge, single crystal silicon technology, applied in the photoengraving process of the pattern surface, the microstructure device composed of deformable elements, the instrument, etc., can solve the problems of lack of overall structure and difficult alignment, and achieve high performance Powerful, wide-ranging effects

Active Publication Date: 2005-09-21
CAPELLA PHOTONICS INC
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Besides the mirrors made of polysilicon (or thin film), another drawback of the resulting array of mirrors is the lack of

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bulk silicon mirrors with hinges underneath
  • Bulk silicon mirrors with hinges underneath
  • Bulk silicon mirrors with hinges underneath

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] Figure 1A-1B The first embodiment of the MEMS device according to the present invention is shown. Figure 1A A schematic side sectional view of the MEMS device 100 is shown, which includes a body element 110; first and second hinge elements 121, 122; and a support 130. The body element 110 may have a “device” (or “top”) surface 112 and a “bottom” surface 111 located below and opposite to the device surface 112. The first and second hinge elements 121, 122 are each arranged below the device surface 112. As Figure 1A In the implementation of the embodiment, the hinge elements 121, 122 are each connected to the bottom surface 111 of the body element 110 at one end, and connected to the support 130 at the other end. In this way, the body element 110 is suspended by the hinge elements 121, 122 arranged entirely under the surface 112 of the device.

[0023] Figure 1B A schematic top view of the MEMS device 100 is shown. With this example, it is shown that the device surface ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A MEMS device (100), includes a body component (110), a first and a second hinges (121,122) and a supporting piece (130). The body component (110) is provided with a top surface and a bottom surface (112,111), and the hinge is provide below the top surface (112).

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner CAPELLA PHOTONICS INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap