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Method and device for detecting contact holes in plasma processing system

A plasma and processing system technology, applied in the field of inspection of contact holes, which can solve the problems of expensive cutting technology, influence, and filling of the contact part.

Inactive Publication Date: 2005-10-19
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it may be difficult to substantially fill contacts with high aspect ratios using metal deposition techniques.
Furthermore, any observed image may be susceptible to the cutting angle of the cutting technique
Also, cutting techniques are often expensive to implement and are therefore only used intermittently

Method used

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  • Method and device for detecting contact holes in plasma processing system
  • Method and device for detecting contact holes in plasma processing system
  • Method and device for detecting contact holes in plasma processing system

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Embodiment Construction

[0050] The invention will now be described in detail with reference to several preferred embodiments as shown in the accompanying drawings. In the following description, numerous details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art from the following description, that the invention may be practiced without some or all of these specific details. In other instances, well known process steps and / or structures have not been described in detail in order not to unnecessarily obscure the present invention.

[0051] While not wishing to be bound by theory, the inventors herein believe that exposure of metals to chlorine-containing gases (e.g., Cl 2 etc.) can produce considerable volumes of metal chlorides. In general, reactive species can be produced by dissociating chlorine gas in a plasma processing system. The chlorine component then reacts with the exposed metal surface atoms to form a metal...

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PUM

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Abstract

In a plasma processing system, a method of inspecting a contact opening of a contact formed in a first layer of the substrate to determine whether the contact reaches a metal layer that is disposed below the first layer is shown. The method includes flowing a gas mixture into a plasma reactor of the plasma processing system, the gas mixture comprising a flow of a chlorine containing gas. The method also includes striking a plasma from the gas mixture; and exposing the contact to the plasma. The method further includes detecting whether metal chloride is present in the contact opening after the exposing.

Description

technical field [0001] Generally, the present invention relates to substrate fabrication techniques, and more particularly, the present invention relates to methods and apparatus for inspecting contact holes in plasma processing systems. Background technique [0002] Plasmas are often employed during the processing of substrates, such as semiconductor substrates or glass sheets such as those used in the manufacture of flat panel displays. For example, as part of substrate processing, the substrate is divided into a plurality of die, or rectangular areas, each of which will become an integrated circuit. The substrate is then processed in a series of steps in which material is selectively removed (etched) and deposited to form electrical components thereon. [0003] In typical plasma processing, the substrate is coated with a thin film of hardened latex (ie, like a photoresist mask) prior to etching. Areas of the hardened latex are then selectively removed, exposing the unde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/00H01J9/42H01L21/00H01L21/66
CPCH01L22/12H01L2924/0002H01J9/42H01L2924/00
Inventor 金智洙李相现姜世安比内·沃斯哈姆严必明礼萨·萨贾迪彼得·K·勒文哈德特
Owner LAM RES CORP