Unlock instant, AI-driven research and patent intelligence for your innovation.

Tin silver copper nickel aluminium series leadless welding flux alloy

A technology of lead-free solder alloys and solder alloys, applied in the field of lead-free solders, tin-silver-copper-nickel-aluminum lead-free solder alloys, which can solve problems such as poor wettability, uneven distribution, and coarse alloy structure, and achieve good wettability , Improve anti-oxidation, good anti-oxidation effect

Inactive Publication Date: 2006-01-11
北京艾达方航空航天材料与设备研发中心
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For Sn-Ag-Cu solder alloys, the overall performance is superior, but it also has disadvantages such as poor wettability, coarse alloy structure, and uneven distribution.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The weight percent of each chemical composition in the lead-free solder alloy is: Ag: 3.8, Cu: 0.3, Al: 0.1, Ni: 0.02, and the balance is Sn. The obtained solder alloy had a solidus temperature of 216.13°C, a liquidus temperature of 219.53°C, and a spreadability of 91.3%.

Embodiment 2

[0019] The weight percent of each chemical composition in the lead-free solder alloy is: Ag: 3.5, Cu: 0.7, Al: 0.2, Ni: 0.10, and the balance is Sn. The obtained solder alloy had a solidus temperature of 216.13°C, a liquidus temperature of 219.53°C, and a spreadability of 91.3%.

Embodiment 3

[0021] The weight percent of each chemical composition in the lead-free solder alloy is: Ag: 3.0, Cu: 1, Al: 0.3, Ni: 0.40, and the balance is Sn. The obtained solder alloy had a solidus temperature of 216.96°C, a liquidus temperature of 220.20°C, and a spreadability of 94.3%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
solidus temperatureaaaaaaaaaa
liquidus temperatureaaaaaaaaaa
solidus temperatureaaaaaaaaaa
Login to View More

Abstract

A lead-free SnAgCuNiAl alloy as solder contains Ag (1.5-4.0 wt.%), Cu (0.1-2.0), Al (0.1-0.5), Ni (0.01-1.0) and Sn (rest). Its advantages are high spreading and anti-oxidizing performance, and high soldering strength and stability.

Description

technical field [0001] The present invention relates to a lead-free solder alloy of tin-silver-copper-nickel-aluminum system, and more specifically relates to a lead-free solder suitable for brazing solder in the fields of electronic assembly and packaging, electronics, electrical equipment, communication equipment, automobiles, etc., belonging to Electronic materials and electronic preparation technology field. Background technique [0002] Sn-Pb alloy, as the main sealing material in the modern electronics industry, occupies a dominant position in the assembly of electronic components. Although Sn-Pb alloys have excellent wettability, weldability, electrical conductivity, mechanical properties, and low cost, due to the toxicity of Pb and Pb compounds, improper use will pollute the environment and damage the health of workers. Protection regulations are becoming more and more perfect and strict, and calls for prohibiting the use of lead are growing louder. [0003] Theref...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00
CPCC22C13/00
Inventor 马莒生
Owner 北京艾达方航空航天材料与设备研发中心