Wet etching device and wet etching method

Abstract

The invention provides a wet etching device, comprising in sequence: a bearing and buffering region; a first etching room using etching liquid to pre-etch and primarily etch a glass substrate; a washing room adopting high pressure water column to eliminate by-products formed on the surface of the glass substrate after the glass substrate is etched in the first etching room; a second etching room; a rising and drying transmission region.

Description

【Technical field】 [0001] The invention relates to a wet etching device and a wet etching method. 【Background technique】 [0002] Wet etching technology has the advantages of low cost, high yield, reliability, and good selectivity to mask and base materials. It is used in the front-end semiconductor process of thin-film transistor liquid crystal display (TFT-LCD). It is widely used in the etching process of glass substrates. [0003] At present, the requirements for the display effect of the display, especially the resolution of the display, are constantly increasing, so the line spacing and line width need to be etched to become thinner and thinner, and the uniformity requirements are becoming more and more stringent; moreover, the glass substrate is also moving towards larger size. direction of development. Therefore, there are higher requirements for etching technology and corresponding equipment. [0004] see figure 1 , is a three-dimensional schematic diagram of a pr...

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Problems solved by technology

[0011] In order to solve the problem in the prior art that the etching quality is reduced and the product yield is low due to the serious undercut phenomenon in the lateral etching of the surrounding area of ​​the glass substrate, the present invention provides a wet etching method with good etching quality and high product yield. equipment

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