Wet etching device and wet etching method

A wet etching and etching technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of decreased etching quality and low product yield, and achieve the effect of good etching quality and high product yield.

Inactive Publication Date: 2006-07-05
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] In order to solve the problem in the prior art that the etching quality is reduced and the product yield is low due to the serious undercut phenomenon in the latera

Method used

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  • Wet etching device and wet etching method
  • Wet etching device and wet etching method
  • Wet etching device and wet etching method

Examples

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Embodiment Construction

[0020] see figure 2 , is a schematic perspective view of the first embodiment of the wet etching equipment of the present invention. The wet etching equipment 20 includes a substrate carrying chamber 211, a buffer chamber 212, a first etching chamber 213, a cleaning chamber 214, a second etching chamber 215, a wet transfer chamber 216, a rinsing chamber 217, a drying chamber 218, a transfer room 219 and a maintenance area 210 in the center.

[0021] The wet etching equipment 20 is arranged horizontally, and the substrate carrying chamber 211 is respectively connected with the buffer chamber 212 and the dry transfer chamber 219 . The substrate carrying chamber 211, the buffer chamber 212, the first etching chamber 213, the cleaning chamber 214, the second etching chamber 215, the wet transfer chamber 216, the rinse chamber 217, the drying chamber 218 and the dry transfer chamber 219 are connected end-to-end in order and surround in a rectangular shape. The maintenance area ...

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Abstract

The invention provides a wet etching device, comprising in sequence: a bearing and buffering region; a first etching room using etching liquid to pre-etch and primarily etch a glass substrate; a washing room adopting high pressure water column to eliminate by-products formed on the surface of the glass substrate after the glass substrate is etched in the first etching room; a second etching room; a rising and drying transmission region.

Description

【Technical field】 [0001] The invention relates to a wet etching device and a wet etching method. 【Background technique】 [0002] Wet etching technology has the advantages of low cost, high yield, reliability, and good selectivity to mask and base materials. It is used in the front-end semiconductor process of thin-film transistor liquid crystal display (TFT-LCD). It is widely used in the etching process of glass substrates. [0003] At present, the requirements for the display effect of the display, especially the resolution of the display, are constantly increasing, so the line spacing and line width need to be etched to become thinner and thinner, and the uniformity requirements are becoming more and more stringent; moreover, the glass substrate is also moving towards larger size. direction of development. Therefore, there are higher requirements for etching technology and corresponding equipment. [0004] see figure 1 , is a three-dimensional schematic diagram of a pr...

Claims

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Application Information

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IPC IPC(8): G03F7/26G03F7/32H01L21/00
CPCH01L21/67173C03C15/00H01L21/67236H01L21/67028
Inventor 高胜洲黄荣龙欧振宪邱立峰
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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