Environmental friendly lead-free solder and its preparation method

A lead-free solder, environment-friendly technology, applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of poor welding quality, excessive welding slag, and many bridging defects, so as to improve the welding quality , The surface of the solder joint is bright, and the effect of avoiding lead poisoning

Inactive Publication Date: 2006-07-12
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the existing lead-free solder is soldered at high temperature, there are often too much solder slag, more bridging defects, and poor soldering quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be described in further detail below in conjunction with specific examples, but the content of the present invention is not limited to the examples.

[0017] Element

1#

2#

3#

4#

5#

6#

Ag

2

2

5

5

2.3

3.6

Cu

0.1

0.1

2

2

0.16

1

Ce

0.001

0.001

0.1

0.1

0.07

0.09

Ni

0.001

0.001

0.5

0.5

0.05

0.15

sn

97.898

97.898

92.4

92.4

97.42

95.16

[0018] Performance of this product

[0019] Adding a certain amount of cerium and phosphorus solder alloy to tin-silver-copper will greatly improve the physical properties, mechanical properties, wettability and structure of solder joints.

[0020] 1. Its conductivity and resistivity are lower than 63Sn-37Pb eutectic alloy.

[0021] 2. The melting temper...

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PUM

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Abstract

The invention relates to welding material, especially providing a high-temperature resistance oxidation environment-friendly leadless solder and relative preparation method. said leadless solder comprises following elements in weight percents: 2-5% AG, 0.1-2% Cu, 0.001-0.1% Ce, 0.001-0.5% Ni and Sn. Compared to present technique, the invention is environment-friendly, which can effectively avoid lead poisoning of operator and when the solder is welded in high temperature (380-500Deg. C), it has minute oxidation sludge. The invention has high-temperature resistance oxidation ability which can keep the surface of tin furnace bright without oxidation in this temperature, and the welded tin furnace can last non-oxidation condition for longer time. The invention has less welding defects compared to common Sn-Ag-Cu system, bright surface of welding point and improved welding quality.

Description

technical field [0001] The invention relates to soldering materials, in particular to a high-temperature oxidation-resistant, environment-friendly lead-free solder and a preparation method thereof. Background technique [0002] The soldering materials in the electronics industry are mainly tin-lead alloys. Although tin-lead alloys have excellent soldering performance, lead is a toxic substance. After entering the human body, it accumulates in the bones and is not easily discharged, causing lead poisoning of operators. Lead-free is the development trend of brazing technology in the microelectronics assembly industry at home and abroad. However, when the existing lead-free solder is soldered at high temperature, there are often too much solder slag, more bridging defects, and poor soldering quality Contents of the invention [0003] The object of the present invention is to provide an environment-friendly high-temperature anti-oxidation lead-free solder and a preparation me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C1/03
Inventor 黄守友
Owner THOUSAND ISLAND METAL FOIL
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