Environmental friendly lead-free solder and its preparation method

Abstract

The invention relates to welding material, especially providing a high-temperature resistance oxidation environment-friendly leadless solder and relative preparation method. said leadless solder comprises following elements in weight percents: 2-5% AG, 0.1-2% Cu, 0.001-0.1% Ce, 0.001-0.5% Ni and Sn. Compared to present technique, the invention is environment-friendly, which can effectively avoid lead poisoning of operator and when the solder is welded in high temperature (380-500Deg. C), it has minute oxidation sludge. The invention has high-temperature resistance oxidation ability which can keep the surface of tin furnace bright without oxidation in this temperature, and the welded tin furnace can last non-oxidation condition for longer time. The invention has less welding defects compared to common Sn-Ag-Cu system, bright surface of welding point and improved welding quality.

Description

technical field

[0001] The invention relates to soldering materials, in particular to a high-temperature oxidation-resistant, environment-friendly lead-free solder and a preparation method thereof. Background technique

[0002] The soldering materials in the electronics industry are mainly tin-lead alloys. Although tin-lead alloys have excellent soldering performance, lead is a toxic substance. After entering the human body, it accumulates in the bones and is not easily discharged, causing lead poisoning of operators. Lead-free is the development trend of brazing technology in the microelectronics assembly industry at home and abroad. However, when the existing lead-free solder is soldered at high temperature, there are often too much solder slag, more bridging defects, and poor soldering quality Contents of the invention

[0003] The object of the present invention is to provide an environment-friendly high-temperature anti-oxidation lead-free solder and a preparation me...