High-precision three-dimensional micro-assembling method and assembly parts based on MEMS

A micro-assembly and high-precision technology, applied in microstructure devices, processing microstructure devices, measurement devices, etc., can solve the problem of limited types of MEMS devices, incomplete optimization of device performance, and inability to realize hybrid integration of multiple MEMS devices, etc. problem, to achieve the effect of high-precision assembly

Inactive Publication Date: 2006-07-19
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the most popular POST-CMOS process method has achieved some commercial success, the types of MEMS devices fabricated using this method are limited, and due to limitations in materials, temperature, etc., device performance cannot be fully optimized.
In addition, the interdisciplinary and cross-en

Method used

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  • High-precision three-dimensional micro-assembling method and assembly parts based on MEMS
  • High-precision three-dimensional micro-assembling method and assembly parts based on MEMS
  • High-precision three-dimensional micro-assembling method and assembly parts based on MEMS

Examples

Experimental program
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Example Embodiment

[0024] 1. Preparation of substrate:

[0025] (1) Growing an insulating layer such as silicon dioxide on the substrate;

[0026] (2) Sputtering the metal adhesion layer and seed layer, and define the metal interconnection;

[0027] (3) Define the location of the groove and electroplate solder bumps;

[0028] (4) Remove the seed layer and metal adhesion layer

[0029] (5) Use photosensitive polymer materials to make micro-fixtures, such as spin-coating SU8;

[0030] (6) The bulk silicon deep groove is etched to form the alignment groove, see figure 1 .

[0031] 2. Preparation of chips to be assembled:

[0032] (1) Growing an insulating layer such as silicon dioxide on the substrate;

[0033] (2) Sputtering the metal adhesion layer and seed layer, and define the metal interconnection;

[0034] (3) Electroplating solder bumps;

[0035] (5) Electroplating alignment posts, such as metal Au;

[0036] (6) Remove the seed layer and metal adhesion layer, see figure 2 .

[0037] Third, use...

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Abstract

The invention discloses a high-precision three-dimensional micro-assembly method and combined component based on MEMS, which comprises the following steps: setting a micro-clamp to match the loading chip; setting the alignment part and alignment accessory and welding button on the corresponding substrate and loading chip separately; injecting liquid in the micro-clamp; putting the chip in the micro-clamp back-off; locating the chip on the substrate through alignment part and alignment accessory and welding fusion reflux.

Description

technical field [0001] The invention belongs to the technical field of micro-electro-mechanical systems (MEMS) processing, and in particular relates to a high-precision three-dimensional micro-assembly method based on MEMS. Background technique [0002] At present, many MEMS-IC integrated device products have come out one after another, such as integrated accelerometer sensors and display chips, integrated gyro sensors, etc. The monolithic integration process technology of MEMS and IC has been developed rapidly, but due to the incompatibility of the two processes and materials The design cycle is longer and the cost is higher. Although the most popular POST-CMOS process method has achieved some commercial success, the types of MEMS devices fabricated using this method are limited, and due to limitations in materials and temperature, device performance cannot be fully optimized. In addition, the interdisciplinary and cross-energy domain characteristics of MEMS devices determ...

Claims

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Application Information

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IPC IPC(8): B81C3/00G01P15/00G01C19/00
Inventor 陈兢杨梅舒琼
Owner PEKING UNIV
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