Symmetric-structure double-grade decoupling single-crystal-silicon micro mechanical gyroscope

A silicon micromechanical and symmetrical structure technology, applied in the field of inertial measurement, can solve the problems of reducing the long-term reliability of the system and increasing the cost of the device, and achieve the effect of easy matching of resonant frequency and high sensitivity

Inactive Publication Date: 2006-10-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, vacuum packaging is usually used, which will increase the cost of the device and reduce the long-term reliability of the system

Method used

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  • Symmetric-structure double-grade decoupling single-crystal-silicon micro mechanical gyroscope
  • Symmetric-structure double-grade decoupling single-crystal-silicon micro mechanical gyroscope

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Embodiment Construction

[0015] Hereinafter, the present invention will be described in more detail with examples in conjunction with the accompanying drawings:

[0016] Combine figure 1 with figure 2 It includes a glass substrate 15, a metal electrode sputtered on the glass substrate, a silicon wafer bonded to the glass substrate through the integral bonding area 1, a driving fixed electrode bonding area 4, a detection fixed electrode bonding area 10, and The structure etched on the silicon chip includes a mass block 14 in the middle, comb drivers symmetrically distributed on both sides of the mass block, comb detectors symmetrically distributed on the other two sides of the mass block, and drive fixed electrodes 3a, 3b is connected with the driving fixed electrode bonding area, the detection fixed electrodes 9a, 9b are connected with the detection fixed electrode bonding area, the driving movable electrode 6 is connected with the driving frame 5, and there is a detection decoupling beam 7 between the d...

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Abstract

The invention relates to a symmetric structure doublestage decoupling single crystal silicon micro mechanic gyroscope that includes glass base sheet, silicon sheet and the structure etched on the silicon sheet. The structure includes mass block, comb type driver and comb type detector. The fixed electrode is connected to bonding area. And the active electrode is connected to the frame. The detecting decoupling beam is set between the driving frame and the mass block. Flexible beam is set between the two ends of the frame. The invention could gain high quality gene under air environment and make the micro mechanic gyroscope have high sensitivity.

Description

(1) Technical field [0001] The invention relates to a micromechanical gyroscope, which belongs to the field of microelectronic mechanical systems and the field of inertial measurement. (2) Background technology [0002] Compared with traditional inertial devices, silicon micromechanical inertial devices have the advantages of small size, low cost, low power consumption, and easy integration with CMOS interface circuits. With the successful application of micromechanical accelerometers in automotive electronic systems, as the main components of micromechanical inertial devices, the research of high-performance micromechanical gyroscopes has received much attention. At present, the following three key points restrict the further improvement of the performance of the micromachined gyroscope. [0003] 1. The matching problem of the resonant frequency of the driving mode of the micromachined gyroscope and the detection mode. Micromechanical gyroscopes mainly have two vertical vibratio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/5684
Inventor 刘晓为陈伟平霍明学谭晓昀陈宏
Owner HARBIN INST OF TECH
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