Plasma treating coil

Abstract

This invention relates to plasma process circle coils mounted on the top cover of a reacting cavity, which are in a solid structure, the circles are placed on different planes and the centers of the circles are on a same axes, the larger of the diameter of a circle, the further away from the top cover of the reacting cavity is and notches are set on the same direction of the circles to form circle in-and-out ports, the outlet of a circle is connected with the inlet of the adjacent outer circle, the inlet of the most inside circle and the outlet of the most outside circle are taken as two lead ends of the plasma process coils to alter the distribution state of the electromagnetic field and increase the uniform distribution degree.

Description

technical field [0001] The invention relates to semiconductor processing equipment, in particular to a plasma processing coil of a semiconductor etching machine. Background technique [0002] In the manufacture of semiconductor devices, the different material layers on integrated circuits or flat panel displays are typically formed by chemical and physical deposition or etching. In a broad sense, etching technology includes the technology of uniformly removing the entire surface of the material, or selectively removing parts with patterns, and its types can be divided into wet etching and dry etching. Dry etching is an etching technique that uses gas discharge to generate plasma to remove thin films. Etching generally occurs in a reaction chamber in a plasma process system. The application of dry etching mainly requires attention to etch rate, etch uniformity and etch profile. Uniformity is an indicator of the difference in etching rate at different etching positions. Bet...

AI Technical Summary

Problems solved by technology

Since the prior art uses a planar coil, its edge plasma uniformity is poor

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