Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polishing composition

A technology for polishing compositions and substrates, which is applied in the field of polishing compositions and can solve problems such as ignorance

Inactive Publication Date: 2006-11-01
FUJIMI INCORPORATED
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cause of these defects is not yet known

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-11 and comparative example 1-5

[0040] Various polishing compositions were prepared by mixing colloidal silica and various compounds shown in Table 1 below in deionized water.

[0041] The pH of each polishing composition in Examples 1-11 and Comparative Examples 1-5 was measured, and the following two items were measured and evaluated. The results are shown in Table 1.

[0042] 1. Polishing efficiency

[0043] Using the polishing composition in each example, the magnetic disk substrate (Ni-P substrate) was polished under the following polishing conditions, and the value of the polishing efficiency was obtained by the calculation formula shown below. The values ​​of polishing efficiency in Table 1 are average values ​​of 10 disk substrates per batch.

[0044] Polishing efficiency (μm / min) = reduction value (g) of the disk substrate weight after polishing ÷ (surface area of ​​the polished surface of the disk substrate (cm 2 )×Ni / P coating density (g / cm 3 )×Polishing time (min))×10,000

[0045] Polishing ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
depthaaaaaaaaaa
Login to View More

Abstract

A polishing composition for polishing a disk substrate, comprising (A) selected from the group consisting of phosphoric acid, phosphate and pyrophosphoric acid, phosphonic acid, phosphinic acid, hydroxyethylene diphosphonic acid, nitrilotri( (Methylenephosphonic acid), phosphonobutanetricarboxylic acid, and salts thereof, (B) colloidal silicon dioxide, (C) water, and (E) diammonium iron edetate .

Description

[0001] This application is a divisional application of a patent application with an application date of December 17, 2002, an application number of 02157402.2, and an invention title of "polishing composition". technical field [0002] This invention relates to polishing compositions for polishing magnetic disk substrates. Background technique [0003] During the production of magnetic disks, polishing is generally performed with a polishing composition to remove waviness or unevenness from the disk substrate and make it smooth. As polishing compositions for polishing magnetic disk substrates, various compositions in which different abrasives are combined with polishing accelerators or other additives have been proposed. [0004] The present inventor carefully observed the surface of a magnetic disk substrate polished with a conventional polishing composition, and found new surface defects that are not considered to be pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02B24B37/00C09G1/04C09G1/18C09K3/14G11B5/84
CPCB24B37/00C09G1/02C09G1/18C09K3/14G11B5/84C09K3/1463G11B5/8404
Inventor 神谷知秀平野淳一安福昇横道典孝大胁寿树
Owner FUJIMI INCORPORATED
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com