Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste

A low-temperature sintering, nano-silver technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high cost, high thermal resistance, conductivity of conductive silver glue, and high temperature resistance of bonding strength. achieve the effect of improving electrical conductivity

Inactive Publication Date: 2006-11-29
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, the domestic high-power light-emitting diode (LED) packaging field mostly uses conductive silver glue. This silver glue has high thermal resistance and the internal basic structure after curing is an epoxy resin skeleton and a silver powder-filled thermal and conductive structure. The stability of heat dissipation and physical properties is extremely unfavorable
In addition, the refractive index of the sealed epoxy is relatively large, so that the internal total reflection critical angle is very small, and only a small part of the light generated by the active layer is output.
The conductive silver glue currently used cannot meet the requirements in terms of conductivity, bonding strength, and high temperature resistance, and the cost is relatively expensive.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0006] The preparation of nano-silver solder paste is prepared by adding silver particles with a particle size of 80nm to dispersant fish oil, binder α-terpineol and solvent acetone, and uniformly mixing with the assistance of an ultrasonic water bath to prepare a nano-silver solder paste. The process of encapsulating LED materials with this nano-silver solder paste is: inject nano-silver solder paste onto the substrate with a TS3030 dispenser and connect it to the LED, and then place it in a sintering furnace for sintering. The specific sintering process is: at 10°C / min Heating rate, after reaching 70°C, keep it warm for 10 minutes to eliminate acetone, then continue to increase the temperature at a rate of 10°C / min to the highest temperature of 290°C, keep it warm for 40 minutes to ensure the bonding strength, and cool the furnace to room temperature naturally.

[0007] In the above-mentioned sintering process, the sintering temperature is lower than 300°C. During the sinteri...

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Abstract

A method of using silver soldering nanopaste to package and connect large power LED in low temperature sintering includes utilizing screen printing to inject silver soldering nanopaste on base plate for connecting LED, sintering it in sintering furnace with temperature rising rate of 10deg.c /min, rising temperature to 50-70deg.c and holding it for 10-12 min. to remove off acetone, using temperature rising rate of 10deg.c /min. to rise temperature to 290deg.c then holding it for 35-40min. for ensuring bind intensity, cooling it by air to room temperature for finishing a sintering package of said LED.

Description

Technical field: [0001] The invention relates to a method for connecting high-power LEDs by low-temperature sintering and packaging with nano-silver solder paste, which belongs to the technology of sintering and packaging and connecting high-power LEDs. Background technique: [0002] At present, the domestic high-power light-emitting diode (LED) packaging field mostly uses conductive silver glue. This silver glue has high thermal resistance and the internal basic structure after curing is an epoxy resin skeleton and a silver powder-filled thermal and conductive structure. The stability of heat dissipation and physical properties is extremely unfavorable. In addition, the refractive index of the sealed epoxy has a large correlation, so that the internal total reflection critical angle is very small, and only a small part of the light generated by the active layer is output. The conductive silver glue currently used cannot meet the requirements in terms of conductivity, bondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 陈旭陆国权宋洁
Owner TIANJIN UNIV
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