Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermal conductive material utilizing electrically conductive nanoparticles

A nanoparticle, conductive technology, applied in the field of thermally conductive materials using conductive nanoparticles, can solve problems such as limiting non-conductive fillers, short circuiting I/O bases, limiting thermal conductivity, etc.

Inactive Publication Date: 2006-12-06
GENERAL ELECTRIC CO
View PDF1 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this application the resin cannot be conductive as this will short out the I / O pads of the component
Therefore, underfill resins are limited to the use of non-conductive fillers
As is the case in TIM materials, this limits the thermal conductivity that can be obtained

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal conductive material utilizing electrically conductive nanoparticles
  • Thermal conductive material utilizing electrically conductive nanoparticles
  • Thermal conductive material utilizing electrically conductive nanoparticles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention provides a thermal interface composition comprising non-conductive micron-sized filler particles and conductive nanoparticles in a polymer matrix. The conductive nanoparticles are used to improve the thermal conductivity of the thermal interface composition. As used herein, a "thermal interface composition" is any material that can be used to carry heat away from high temperature areas in an electrical system, and can include thermal interface materials ("TIMs") that are placed between heat sinks and heat generating components of electronic devices. ) or underfill materials used in integrated circuit packages (ie, chips) to fill the gap between the chip and the substrate and to improve the fatigue life of the solder by removing the heat generated during thermal cycling. The present invention also provides a thermal interface composition comprising conductive nanoparticles in a polymer matrix without non-conductive micron-sized filler particles, whi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

Thermal interface compositions (10) contain both non-electrically conductive micronsized fillers (18) and electrically conductive nanoparticles (20) blended with a polymer matrix (16). Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles (20) also show less phase separation of micron-sized particles (18) than formulations without nanoparticles (20). Methods for increasing heat transfer include using such compositions between heat producing components (12) and heat sinks (14). Electronic components utilizing such compositions are also disclosed.

Description

technical field [0001] The present invention involves the use of conductive nanoparticles in combination with non-conductive micron-sized fillers to enhance the thermal conductivity of polymeric matrices. Background technique [0002] Many electronic components generate heat during operation. If this heat is not removed from the electronic components in an efficient manner, they will accumulate. Electronic components may then fail or be permanently damaged. Accordingly, thermal management techniques are often implemented in circuits and electrical systems to facilitate heat removal during operation. [0003] Thermal management techniques generally involve the use of some form of heat sink to direct heat away from high temperature areas in an electrical system. A heat sink is a structure formed of a highly thermally conductive material, such as typically metal, that is mechanically attached to an electronic component to aid in heat removal. In a relatively simple form, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/42H01L23/373H01L21/56C09K5/14
CPCH01L2924/01015C09K5/14H01L2924/01046H01L2924/0105H01L2924/01082H01L2924/01004H01L24/29H01L2924/01045H01L2924/01002H01L2224/29386H01L2924/01019H01L2924/01044H01L2924/01029H01L2924/00013H01L2224/29H01L2924/014H01L2924/01013H01L2224/29101H01L2224/8385H01L23/373H01L2224/29393H01L2224/29298H01L2924/0665H01L2924/0103H01L2224/2919H01L2224/2929H01L2924/01047H01L2924/01079H01L2924/0104H01L2924/14H01L24/83H01L2924/01005H01L2924/01033H01L2924/01006H01L23/3732H01L2924/01074H01L2924/01078H01L2924/01012H01L23/3737H01L2924/07802H01L2924/01051H01L2224/293H01L2224/29499H01L2224/32245H01L2924/12044H01L2924/00H01L2924/00014H01L2924/05442H01L2224/29099H01L2224/29199H01L2224/29299C09K5/00C09K5/08B82B1/00
Inventor 桑迪普·S·托纳皮钟泓戴维·L·西蒙娜雷蒙德·A·菲利昂
Owner GENERAL ELECTRIC CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com