Chuck workbench moving arrangement

A technology of chuck table and moving mechanism, which is applied in the direction of metal processing machinery parts, manufacturing tools, conveyor objects, etc., and can solve problems that may not be able to meet the high-precision movement of chuck table
CN1885520AActive Publication Date: 2006-12-27DISCO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DISCO CORP
Publication Date
2006-12-27

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Abstract

The present invention provides one kind of chuck bench moving mechanism capable of absorbing the vibration of the external screw and supporting the chuck bench with supported machined article to move at high precision. The chuck bench moving mechanism possesses a chuck bench supporting mechanism, a guide track and an external screw. The chuck bench supporting mechanism is provided with a supporting pedestal; several movable pedestals set between the supporting pedestal and the external screw, including one adjacent to the external screw with inner thread fitting the thread in the external screw; and several power transmitting mechanisms set separately between the movable pedestal adjacent to the supporting pedestal and the supporting pedestal and between two adjacent movable pedestals, and with vibration absorbing mechanism to transmit the power in the machining feeding direction.
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Description

technical field

[0001] The present invention relates to a chuck table moving mechanism, which is equipped on a cutting device that cuts a workpiece such as a semiconductor wafer or a processing device such as a laser processing device that applies laser processing to a processed object, so that the chuck that supports the processed object The disc table moves in the machining feed direction. Background technique

[0002] In the manufacturing process of semiconductor devices, on the surface of a substantially disk-shaped semiconductor single crystal, a plurality of areas are divided by dividing lines called "streets" arranged in a grid pattern, and ICs are formed on the divided areas. , LSI and other circuits. Then, the semiconductor wafer is cut along planned dividing lines to divide into regions where circuits are formed, thereby manufacturing individual semiconductor chips. And by laminating the single crystal of optical devices such as gallium nitride-based compound sem...

Claims

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