Production process tape for film-shaped wiring board

A technology for wiring substrates and production processes, which is applied in the field of tapes for production processes, can solve problems such as lower yields and increased product costs, and achieve the effects of avoiding cost increases and improving yields

Inactive Publication Date: 2006-12-27
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The process tape used in the production process of film-like substrates needs to have heat resistance and mechanical strength, but if the product itself is used as a traction tape, the yield will decrease, or an expensive thick heat-cured tape will be used. Non-resilient polyimide resin flakes will lead to problems such as increase in product cost

Method used

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  • Production process tape for film-shaped wiring board
  • Production process tape for film-shaped wiring board
  • Production process tape for film-shaped wiring board

Examples

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Embodiment

[0040] The present invention will be described in further detail below through examples and comparative examples, but the present invention is not limited to these examples. Raw materials used in Examples and Comparative Examples are as follows.

[0041] *1. Polysulfone resin

[0042] Udel P-1700NT (trade name) manufactured by Solvay Advanced Polymers

[0043] *2. Thermoplastic polyimide resin

[0044] ULTEM CRS5001-1000 made by GE

[0045] *3. Polyether aromatic ketone resin

[0046] PEEK450G (trade name) manufactured by VICTREX

[0047] *4. Glass fiber (fibrous)

[0048] RES-TP29 made by Asahi Glass Aspect ratio: 100 or more

[0049] *5. Alumina particles (granular)

[0050] AO-502 made by Admatechs Aspect ratio: 1

[0051] *6. Plate talc (plate shape)

[0052] Japan Talc MS-1 aspect ratio: 17, average particle size: 13μm

[0053] *7. Plate talc (plate shape)

[0054] Japan Talc L-1 aspect ratio: 25, average particle size: 5μm

[0055] According to the blending r...

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Abstract

A production process tape for film-shaped wiring board that exhibits high heat resistance, mechanical properties, moldability and dimensional stability and that excels in productivity and workability, realizing low cost. There is provided a production process tape for film-shaped wiring board, which consists of a sheet comprising at least one thermoplastic resin, the thermoplastic resin selected from among a polysulfone resin, a thermoplastic polyimide resin and a polyether aromatic ketone resin, and a plate filler, which sheet exhibits an antiflexing strength (JIS P8155: tension 250 g, flexing rate 175 times / min, and flexing surface 0.38R) of 10 times or more and a linear expansion coefficient of 50 ppm / DEG C or below.

Description

technical field [0001] The present invention relates to a tape for a production process of a film-shaped wiring board that is required to have excellent heat resistance and mechanical strength. Background technique [0002] Conventionally, polyether aromatic resins have been widely recognized as engineering plastics having excellent heat resistance, mechanical properties, and the like. In order to further expand the use of these resins, it is attempted to add fillers to super engineering plastics such as polyether aromatic ketone resins and thermoplastic polyimide resins to improve their physical properties. For example, it has been proposed to add various inorganic fiber fillers in an attempt to improve their mechanical strength and heat resistance (JP-A-63-22854). [0003] Examples of film-like wiring boards (hereinafter simply referred to as boards) required for electronic components include boards called FPC (flexible printed circuit), TAB (tape automated bonding), and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18H01L21/60C08K3/22C08L81/06C08L79/08H05K1/00H05K1/03
CPCH05K1/0393H05K2201/068H05K2201/0245H05K2201/0129H05K1/0373C08J5/18H05K2201/0209C08K3/22
Inventor 金田有弘
Owner SUMITOMO BAKELITE CO LTD
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