Unlock instant, AI-driven research and patent intelligence for your innovation.

Tape with embedded IC chip and sheet with embedded IC chip

A chip and sheet technology, applied in the field of IC chip built-in sheet, can solve the problems of IC chip damage, circuit, function damage, IC chip easily peeled off, etc., and achieve the effect of preventing damage

Inactive Publication Date: 2007-01-03
OJI PAPER CO LTD +2
View PDF12 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] (1) Since the portion of the filament bonded to the IC chip forms a convex portion, the IC chip is easily peeled off under external force
Especially in the place where mechanical external force, heating, etc. are required in the papermaking process (dehydration, pressing, drying, calendering), the IC chip may peel off and fall off from the filament, but when this kind of peeling occurs, it is because of the papermaking process. It is difficult to detect its falling off, so there is such a problem: After papermaking, after printing as an anti-counterfeit coupon, even if it is confirmed that there is a product with an IC chip that has fallen off, it must be printed on the serial number (attach the number to the anti-counterfeiting coupon). ) reprinted in
In addition, there is a possibility that the IC chip may fall off during distribution or use.
[0015] (2) Because the portion of the filament where the IC chip is attached forms a convex portion, the IC chip itself may be damaged under the action of external force such as calendering, and the circuit and function may be damaged. may be damaged
[0020] iii. Generate gloss reduction
[0021] (4) Due to the unevenness caused by the thick and thin part of the paper in the insertion part, it is not suitable for the printing method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tape with embedded IC chip and sheet with embedded IC chip
  • Tape with embedded IC chip and sheet with embedded IC chip
  • Tape with embedded IC chip and sheet with embedded IC chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0125] (Production of IC chip built-in tape)

[0126] A polyethylene terephthalate (PET) film having a thickness of 75 μm was cut into a width of 2.5 mm to obtain a tape body having a length of 500 m. Next, through-holes of 0.6 mm in length and width were provided in the cut PET film by press processing using a die. Next, a seal tape (trade name: Denka Thermo (Denka Thermo) film ALS) manufactured by Denka Kagaku Kogyo Co., Ltd. was attached to one side (back surface) of the PET film provided with through holes, and the above-mentioned through holes were used as recesses.

[0127] Then, insert a micro IC chip with a side of 0.5 mm and a thickness of approximately 70 μm into the concave portion from the surface to which the PET film tape is attached and the opposite surface (surface), and then attach the same tape as the back surface to the front surface. . Thus, an IC chip-embedded tape is produced in which the entirety of the minute IC chips is embedded in the tape main body...

Embodiment 2

[0140] Using a cylinder paper machine with three layers of cylinder rolls, paper with built-in IC chips was manufactured in three layers at a papermaking speed of 50 m / min. At this point, the first layer and the second layer (the dry weight is each 51g / m 2 paper) in the usual way, when the third layer (dry weight 51g / m 2 In the case of paper), an IC chip built-in tape was inserted in the same manner as in Example 1.

[0141] On the third layer of the cylinder, at the position where the IC chip built-in tape is inserted, a mark is pasted on the surface of the cylinder and copied so that 10mm square through windows are formed at predetermined intervals. In this way, an IC chip-embedded sheet in which the IC chip-embedded tape inserted into the paper layer can be seen from the paper surface at predetermined intervals is manufactured.

Embodiment 3

[0143] The weight on the floor is 51g / m 2 On the paper, the ethylene-vinyl acetate copolymer adhesive (trade name "Sybinol DBA107" manufactured by Saiden Chemical) was applied by a roll coater at 10g / m 2 The amount of coating is applied, when the amount of paste on the adhesive surface is 51g / m 2 In the case of paper, the IC chip built-in tape used in Example 1 was inserted between the two papers to manufacture an IC chip built-in sheet.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

A sheet with a built-in IC chip in which mechanical external forces do not significantly impinge on the IC chip and the IC chip does not separate or become damaged, and a tape with a built-in IC chip used for the sheet with a built-in IC chip. In the tape with a built-in IC chip, a part or all of the IC chip is embedded in a tape body.

Description

technical field [0001] The present invention relates to an IC chip built-in tape used for an IC chip built-in sheet, and an IC chip built-in sheet using the IC chip built-in tape. [0002] This application claims the priority right on the basis of the Japanese patent application No. 2003-411762 filed on December 10, 2003 and the Japanese patent application No. 2004-267161 filed on September 14, 2004. content. Background technique [0003] In recent years, with the advancement of copier technology, counterfeiting of securities has become easier and has become a major social problem. Therefore, various anti-counterfeiting measures have been taken in order not to illegally alter or counterfeit banknotes, commodity certificates, checks, stocks, passports, ID cards, cards, etc. [0004] As an anti-counterfeiting measure, a so-called "filament-added paper" anti-counterfeiting paper in which threads (tapes) called "filaments" are drawn between paper layers has been developed (Jap...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/00D21H21/42G06K19/04G06K19/077G07D7/00
CPCG06K19/041H01L2924/0002G06K19/07745D21H21/42H01L23/3107G06K19/07728H01L2924/19041G06K19/07718G07D7/0093B42D25/355G07D7/01Y10T428/23Y10T428/22H01L2924/00
Inventor 绫木光弘神田伸夫富田敬太郎尾崎强杉村诗朗小林英树
Owner OJI PAPER CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com