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Lead-free solder alloy

A lead-free solder and alloy technology, applied in the direction of welding medium, metal processing, welding equipment, etc., can solve the problems of reduced impact resistance, etc., and achieve the effects of excellent impact resistance, excellent detection, and excellent heat cycle resistance

Active Publication Date: 2007-01-31
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case the impact resistance is also reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Table 1 Examples and comparative examples of surface lead-free solder alloys.

[0031] Composition (mass%)

Drop impact (times)

Thermal cycling

(Second-rate)

discoloration

(yellowing)

sn

Ag

Cu

Zn

other

room temperature

heat treatment

Reality

Shi

example

1

Bal

0.1

0.01

0.005

170

46

1505

Have

2

Bal

1

0.1

0.1

128

46

1560

Have

3

Bal

2

0.1

0.1

106

43

2040

Have

4

Bal

1

0.1

0.005

Ge0.03

100

49

1621

none

5

Bal

1

0.1

0.05

Ga0.01

113

50

1555

none

6

Bal

1

0.1

0.03

P0.01

114

56

1680

none

7

Bal

1

0.1

...

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PUM

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Abstract

[problems] a mobile electronic device is very often dropped while in use or in transportation to cause the soldered portions of electronic parts to peel off due to an impact by the dropping. The inner coils or resistors or the like in an electronic device are subjected to a heat cycle that they generate heat to cause soldered portions to be heated to high temperature while in used and they are cooled while not in use. Conventional sn-ag based lead-free solder has not provided sufficient impact resistance or heat cycle resistance to fine portions such as bumps. This invention provides lead-free solder alloy that provides excellent impact resistance and heat cycle resistance to bumps. [means for solving problems] the lead-free solder alloy consists of less than 0.1-2.0 mass% of ag, 0.01-0.1 mass% of cu, 0.005-0.1 mass% of zn, and the remaining portion of sn, wherein ga, ge, p are added to the alloy, and ni, co are further added to the alloy.

Description

technical field [0001] The present invention relates to a lead-free solder alloy, which is a lead-free alloy and is particularly suitable for forming minute soldering portions such as solder bumps. Background technique [0002] Solder bumps are used to mount multifunctional components (hereinafter referred to as BGA, etc.) such as BGA (Ball Grid Arrey) and CSP (Chip Size Package) on printed circuit boards. That is to say, solder bumps are formed on the electrodes in advance on the BAG, etc., and when the solder bumps are installed on the printed circuit board, after the solder bumps are placed on the soldered part of the printed circuit board, they are heated by a heating device such as a reflow furnace to make the solder bumps. The block melts. Then, the solder bumps formed on the BAG or the like are soldered between the electrodes of the BAG or the like and the soldered portion of the printed circuit board to conduct electricity. [0003] Also, in an electronic component...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCC22C13/00B23K35/262B23K2201/36B23K2101/36
Inventor 大西司八卷得郎雨海正纯渡边雅子
Owner SENJU METAL IND CO LTD
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