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Developing treatment apparatus and developing treatment method

A technology of processing device and processing unit, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., which can solve problems such as developing defects, uneven developing, and uneven concentration of developer, so as to suppress the generation of particles and stabilize the developer , Yield improvement effect

Inactive Publication Date: 2007-02-07
TOKYO ELECTRON LTD
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

If convection occurs in the developer as described above, it may cause, for example, uneven concentration of the developer on the wafer, resulting in uneven development.
In addition, residues in the developer solution may adhere to the pattern on the front surface of the wafer, causing development defects in this part

Method used

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  • Developing treatment apparatus and developing treatment method
  • Developing treatment apparatus and developing treatment method
  • Developing treatment apparatus and developing treatment method

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Embodiment Construction

[0038] Next, the best mode for carrying out the present invention will be described. figure 1 It is a longitudinal cross-sectional explanatory view showing a schematic configuration of the development processing apparatus 1 according to the present embodiment. figure 2 It is an explanatory cross-sectional view schematically showing the configuration of the development processing device 1 .

[0039] The development processing device 1 has, for example, figure 1 A closed processing vessel 10 is shown. The processing container 10 is shaped in the X direction ( figure 1 The left and right directions) are formed in an approximately rectangular parallelepiped shape. In the processing container 10 , a transfer unit 11 for transferring the wafer W to the outside and a development processing unit 12 for developing the wafer W are arranged in line in the X direction. In addition, if figure 2 As shown, the processing container 10 is provided with a transport mechanism 13 for transpo...

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Abstract

In the present invention, a substrate transfer unit from which a substrate is transferred from / to the outside of a treatment container and a developing treatment unit in which development of the substrate is performed are arranged side by side in the treatment container, and a carrier mechanism is provided which carries the substrate while grasping an outside surface of the substrate from both sides, between the substrate transfer unit and the developing treatment unit. A developing solution supply nozzle for supplying a developing solution onto the substrate and a gas blow nozzle for blowing a gas to the substrate, are provided between the substrate transfer unit and the developing treatment unit and above a carriage path along which the substrate is carried, and a cleaning solution supply nozzle is provided in the developing treatment unit for supplying a cleaning solution onto the substrate. According to the present invention, since the substrate is carried with its outside surface being grasped, spread of contamination can be prevented to restrain generation of particles in the treatment container.

Description

technical field [0001] The present invention relates to a development treatment device and a development treatment method of a substrate. Background technique [0002] For example, in a photolithography process of a semiconductor device manufacturing process, for example, a development process is performed to develop a wafer exposed according to a predetermined pattern. This development treatment is usually performed in a development treatment device. In this development processing apparatus, for example, a wafer is rotated by a spin chuck, a developer is supplied to the wafer from a developer supply nozzle, and a developer liquid film is formed on the front surface of the wafer to develop the wafer. [0003] However, the above-mentioned development processing apparatus needs to rotate the wafer, so a high-torque spin motor must be used for the spin chuck. Therefore, the motor takes up a lot of space, resulting in a bulky development processing device. In addition, the el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/30H01L21/027
Inventor 北野高广饱本正巳锦户修一熊谷大
Owner TOKYO ELECTRON LTD
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