Developing treatment apparatus and developing treatment method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Publication Date
- 2007-02-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to a development treatment device and a development treatment method of a substrate. Background technique
[0002] For example, in a photolithography process of a semiconductor device manufacturing process, for example, a development process is performed to develop a wafer exposed according to a predetermined pattern. This development treatment is usually performed in a development treatment device. In this development processing apparatus, for example, a wafer is rotated by a spin chuck, a developer is supplied to the wafer from a developer supply nozzle, and a developer liquid film is formed on the front surface of the wafer to develop the wafer.
[0003] However, the above-mentioned development processing apparatus needs to rotate the wafer, so a high-torque spin motor must be used for the spin chuck. Therefore, the motor takes up a lot of space, resulting in a bulky development processing device. In addition, the el...