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Optical module with flexible substrate

A technology of flexible substrates and optical components, applied in the direction of electrical components, electrical solid devices, semiconductor devices, etc., can solve problems such as degradation of high-frequency characteristics, and achieve the effect of eliminating the degradation of high-frequency characteristics

Inactive Publication Date: 2007-02-21
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the reasons for taking such a configuration is because, without using the flexible substrate 130, such as Figure 4 As shown, if the lead wire 111 of the optical module 110 is bent and electrically connected (soldered) directly to the circuit board 150, the inductance component will appear at the lead wire 111, and the high-frequency characteristics will be significantly deteriorated (see Figure 4 )

Method used

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Experimental program
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Effect test

Embodiment approach 1

[0051] The optical transceiver according to Embodiment 1 of the present invention will be described with reference to the drawings. figure 1 (A) A side view inside the housing schematically showing the structure of the optical transceiver according to Embodiment 1 of the present invention, (B) a view when viewed from the arrow L direction, and (C) a partial cross-section between XX' Figure.

[0052] The optical transceiver is an optical module with a flexible substrate formed by electrically connecting an optical module 10 and a circuit substrate 50 through a flexible substrate 30. The optical module 10 includes a housing 20, a flexible substrate 30, and a circuit substrate 50.

[0053] The optical component 10 is a device for converting optical signals into electrical signals, using single-mode fiber (SMF) or multi-mode fiber (MMF) as a transmission line to transmit and receive data among communication equipment, network equipment, computers, and storage devices . For example, t...

Embodiment approach 2

[0064] The optical transceiver according to Embodiment 2 of the present invention will be described with reference to the drawings. figure 2 (A) A side view of the housing, (B) a view when viewed from the direction of arrow M, and (C) a partial cross-section between YY', schematically showing the structure of the optical transceiver according to Embodiment 2 of the present invention Figure.

[0065] The optical transceiver according to the second embodiment is different from the optical transceiver according to the first embodiment in the configuration of the flexible substrate 70.

[0066] The flexible substrate 70 is formed by forming a surface wiring layer 72 and a back wiring layer 74 made of copper foil of a predetermined thickness on both sides of a polyimide layer 73 of a predetermined thickness, and the surface on the side of the surface wiring layer 72 is covered by a cover layer 71 , The surface on the side of the back wiring layer 74 is covered by the cover layer 75. T...

Embodiment approach 3

[0073] The optical transceiver according to Embodiment 3 of the present invention will be described with reference to the drawings. Figure 6 (A) A side view inside the housing schematically showing the configuration of the optical transceiver according to Embodiment 3 of the present invention, (B) a view when viewed from the direction of arrow P, and (C) a partial cross-section between QQ' Figure.

[0074] The optical transceiver according to the third embodiment changes the solder connection locations in the optical transceiver according to the first embodiment from two locations to three locations (there may be three or more locations). The other structure is the same as that of the first embodiment.

[0075] According to the third embodiment, by increasing the connection points between the header 12 and the back wiring layer 34a, the GND is further strengthened, and the high-frequency characteristics are improved. Also, since the adhesive area of ​​the dummy wiring pattern 32b ...

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PUM

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Abstract

An optical module with flexible substrate that improves high-frequency characteristics. A flexible substrate 30 is formed with a top wiring layer 32 and a bottom wiring layer 34 formed on both surfaces of a polyimide layer 33 , where the top wiring layer 32 has a plurality of wiring patterns 32a that electrically connect the leads 11 of the optical module 10, and the bottom wiring layer 34 is located on the entire surface of one side of the polyimide layer 33 so that it is electrically insulated from the wiring patterns 32a, is electrically connected to at least the leads 11 and, depending on its relationship with the wiring patterns 32a, to the stem 12 of the optical module 10 at a specified position of a stub region 34 a having stub structure.

Description

Technical field [0001] The present invention relates to an optical component with a flexible substrate that electrically connects a circuit substrate and an optical component through a flexible substrate, and particularly relates to an optical component with a flexible substrate that can improve high-frequency characteristics. Background technique [0002] In recent years, optical transceivers 101 such as XFP (10 Gigabit Small Form Factor Pluggable) have mounted optical components 110 (light-receiving elements, light-emitting elements) in the chassis 120. In order to ensure high-frequency transmission characteristics of the 10GBps level, flexible The substrate 130 electrically connects the optical component 110 and the circuit substrate 150 (a board with a driver circuit) (refer to image 3 , Refer to Patent Document 1). One of the reasons for such a configuration is that the flexible substrate 130 is not used, such as Figure 4 As shown, if the lead 111 of the optical module 110...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/498H01L31/02H05K1/00
Inventor 御田村和宏渡边功伊藤荣记
Owner RENESAS ELECTRONICS CORP
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