Semiconductor chip assembly with metal containment wall and solder terminal

A technology of chip packaging structure and conductor chip, which is used in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc.
CN1921096AInactive Publication Date: 2007-02-28BRIDGE SEMICON
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BRIDGE SEMICON
Publication Date
2007-02-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a semiconductor chip assembly which includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pad. The metal containment wall includes a cavity, and the solder terminal contacts the metal containment wall in the cavity and is spaced from the routing line.
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Description

technical field

[0001] The invention relates to a semiconductor chip package structure, especially a semiconductor chip package structure with a metal wall at the soldering end, and a manufacturing method of the semiconductor chip package structure. Background technique

[0002] Currently, semiconductor chips have input / output pads, which must be connected to external circuits so that they can realize part of the functions of the electronic system. The connection medium is mainly a metal wire array (such as a lead frame) or a support circuit (such as a substrate), although the connection medium can be directly connected to the circuit operation panel (such as a motherboard). Currently, many connection technologies are widely used, including wire bonding, tape automated bonding (TAB) and flip-chip bonding.

[0003] During the next level of assembly, the semiconductor chip package structure is connected to other circuitry such as a printed circuit board (PCB) or motherboard. ...

Claims

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