Semiconductor chip assembly with metal containment wall and solder terminal

A technology of chip packaging structure and conductor chip, which is used in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc.

Inactive Publication Date: 2007-02-28
BRIDGE SEMICON
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solder balls are easily detached from the resin, which has the same problem as the aforementioned metal element surface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor chip assembly with metal containment wall and solder terminal
  • Semiconductor chip assembly with metal containment wall and solder terminal
  • Semiconductor chip assembly with metal containment wall and solder terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0347] 1a to 27c are the first embodiment of the method for manufacturing a semiconductor chip package structure, wherein FIGS. 1a to 27a are schematic cross-sectional views, FIGS. 1b to 27b are schematic top views, and FIGS. 1c to 27c are schematic bottom views.

[0348] As shown in FIG. 1a, FIG. 1b and FIG. 1c, it is a schematic cross-sectional view of the semiconductor chip structure of the present invention, a schematic top view of the semiconductor chip structure of the present invention, and a schematic bottom view of the semiconductor chip structure of the present invention. As shown in the figure: the present invention is a semiconductor chip packaging structure with a metal wall at the welding end, wherein the semiconductor chip 110 is an integrated circuit, and is composed of a plurality of transistors, circuits, connecting parts and other connections (in the figure not shown). The semiconductor chip 110 includes a corresponding first plane 112 and a second plane 114...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to a semiconductor chip assembly which includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pad. The metal containment wall includes a cavity, and the solder terminal contacts the metal containment wall in the cavity and is spaced from the routing line.

Description

technical field [0001] The invention relates to a semiconductor chip package structure, especially a semiconductor chip package structure with a metal wall at the soldering end, and a manufacturing method of the semiconductor chip package structure. Background technique [0002] Currently, semiconductor chips have input / output pads, which must be connected to external circuits so that they can realize part of the functions of the electronic system. The connection medium is mainly a metal wire array (such as a lead frame) or a support circuit (such as a substrate), although the connection medium can be directly connected to the circuit operation panel (such as a motherboard). Currently, many connection technologies are widely used, including wire bonding, tape automated bonding (TAB) and flip-chip bonding. [0003] During the next level of assembly, the semiconductor chip package structure is connected to other circuitry such as a printed circuit board (PCB) or motherboard. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/488
CPCH01L2224/48091H01L2224/73265H01L2224/32145H01L2224/48465H01L2924/3025H01L2224/92144H01L2224/92247H01L2924/181H01L2224/32225H01L2924/00014H01L2924/00H01L2924/00012
Inventor 林文强王家忠
Owner BRIDGE SEMICON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap