Substrate conveyer, substrate conveying method and coating, developing apparatus

Abstract

Provided is a substrate transfer device capable of reducing contaminations such as reattachment of liquid droplets onto a substrate due to pre-attachment of liquid droplets onto the rear side of the substrate. The substrate transfer device has a main arm body for tranferring the substrate exposed by liquid immersion, comprises a support located at an arm body for supporting the inner side rather than the periphery at the rear side of a substrate, a control unit located in opposition to the support with the periphery of the substrate in-between in order to control the peripheral position of the substrate, and a liquid receptacle provided at a location lower than the rear side area of the substrate between the support and control unit. Any liquid droplets attached to the periphery at the rear side of the substrate can be removed onto the liquid receptacle. There are no possibilities that the periphery of the substrate will collide with the liquid receptacle even if the substrates are repeatedly transported and liquid droplets accumulate in the liquid receptacle, thereby reducing attachment chances of any splashed liquid droplets onto the top surface of the substrate.

Description

technical field [0001] The present invention relates to a substrate transfer device for transferring a substrate after liquid immersion exposure processing, for example, a substrate after liquid immersion exposure treatment, a substrate transfer method, and a coating method including the above substrate transfer device. , Developing device. Background technique [0002] Conventionally, in a photoresist process which is one of the semiconductor manufacturing processes, a resist is applied on the surface of a semiconductor wafer (hereinafter referred to as "wafer"), and the resist is exposed in a predetermined pattern. A developing solution is supplied to the wafer for development to form a resist pattern. Such processing is generally performed using a system in which an exposure device is connected to a processing block of a coating, developing device including a coating unit and a developing unit. [0003] The transfer of the wafer from the processing block to the exposure...

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Problems solved by technology

Then, when the wafer W is transported by the arm main body 13 again, as shown in FIGS. Vibration of the arm main body 13 during transfer may cause the particles 10 to scatter and transfer to the wafer W

In addition, in Patent Document 1, a substrate holding device installed in a coating and developing device is described, but there is no description of a countermeasure for the above-mentioned problem when introducing a liquid immersion exposure process.

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