Substrate processing system and method

Abstract

Provided is a substrate processing system and a method for improving throughput in a multichamber type substrate processing system in which one or more of single-stage or two-stage substrate processing chambers can be mixed. An optimal method in the substrate processing system for carrying in and out a substrate can be selected from a first procedure for causing carrying arms to simultaneously enter and exit from chambers to carry in and out the substrate, depending on the kind of the chambers and processing of the substrate; a third procedure for causing the two carrying arms to enter the chambers at different timing to carry in and out the substrate; and a second procedure for performing just carrying in and out the substrate simultaneously, which is intermediate between the first and the third procedure.

Description

technical field [0001] The present invention relates to a substrate processing system and method using a plurality of processing chambers such as a load lock chamber and a substrate processing chamber, and a transfer chamber for transferring substrates between the plurality of processing chambers. Background technique [0002] Conventionally, various substrate processing methods and apparatuses for performing substrate processing on substrates such as LCDs (liquid crystal displays) and semiconductor wafers are disclosed. For example, Patent Document 1 discloses a multi-chamber substrate processing system in which a load-lock chamber for loading and unloading substrates is provided around a transport chamber for transporting substrates, and a load-lock chamber for loading and unloading substrates is provided around the transport chamber for transporting substrates, and a load-lock chamber for loading and unloading substrates is provided around the transport chamber for transpo...

AI Technical Summary

Problems solved by technology

Therefore, in the case where a single-layer substrate processing chamber and a double-layer substrate processing chamber are mixed, in the substrate processing system and substrate processing method of the prior art that carry out substrate loading and unloading in the same way, the double-layer substrate processing On the contrary, as with the single-layer chamber, substrates are loaded and unloaded on each layer separately, thereby reducing productivity.

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