Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board

一种树脂组合物、金属箔的技术，应用在印刷电路、印刷电路、印刷电路制造等方向，能够解决结合强度低、裂纹、断路等问题，达到改善阻燃性、高耐热性和低热膨胀性的效果

Inactive Publication Date: 2007-03-28
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the layers are combined through the fine holes in the process to form a laminated multi-layer interconnected board, the bonding strength is low. With the change of the use environment, when it is subjected to thermal shock, it will appear due to the insulating resin The stress created by the difference in thermal expansion between copper and copper can cause cracking and / or open circuit problems

Method used

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  • Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board
  • Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0110] The present invention will be described in detail below with embodiments.

[0111] The raw material used in the embodiment is as follows:

[0112] (1) Cyanate resin A / phenolic cyanate resin: purchased from Lonza, trade name: "Primaset PT-30", weight average molecular weight 700;

[0113] (2) Cyanate resin B / phenolic cyanate resin: purchased from Lonza, trade name: "Primaset PT-60", weight average molecular weight 2600;

[0114] (3) Epoxy resin / biphenylene xylene epoxy resin: purchased from Nippon Kayaku Co.Ltd, trade name: "NC-3000", weight 275 per epoxy equivalent, weight average molecular weight 2000;

[0115] (4) A copolymer of phenoxy resin A / biphenyl epoxy resin and bisphenol S epoxy resin, the end group of which has an epoxy functional group: purchased from Japan Epoxy Resin company Co.Ltd., trade name: "YX- 8100H30", weight average molecular weight 30000;

[0116] (5) A copolymer of phenoxy resin B / bisphenol A epoxy resin and bisphenol F epoxy resin, the end g...

experiment example A1

[0121] (1) Preparation of resin paint

[0122] 25 parts by weight (PBW) of cyanate resin A, 25 PBW of epoxy resin, 10 PBW of phenoxy resin A, and 0.4 PBW of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Then, add 40PBW of inorganic filler and 0.2PBW of coupling agent, and stir with a high-speed stirrer for 10 minutes to prepare a resin paint with a solid content of 50wt%.

[0123] (2) Manufacture of resin-attached metal foil

[0124] The resin varnish obtained above was coated on the anchor surface (anchor surface) of an electrolytic copper foil (available from Furukawa Circuit Foil Co. Ltd., trade name "GTSMP-18") with a thickness of 18 μm using a COMMA BAR coater, The resin layer was thus made to have a thickness of 60 μm after drying, and then the resulting article was dried in a drier at 160° C. for 10 minutes to obtain a resin-attached metal foil.

[0125] (3) Manufacture of multilayer printed circuit boards

[0126] The resin-attached metal foil...

experiment example A2

[0131] 15PBW cyanate resin A, 10PBW cyanate resin B, 25PBW epoxy resin, 10PBW phenoxy resin A, and 0.4PBW curing catalyst were dissolved and dispersed in methyl ethyl ketone. Then, add 40PBW of inorganic filler and 0.2PBW of coupling agent, and stir with a high-speed stirrer for 10 minutes to obtain a resin paint with a solid content of 50wt%.

[0132] Using this resin varnish, a resin-attached metal foil and a multilayer printed wiring board were produced as described in Experimental Example A1.

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Abstract

Production of a multilayer printed wiring board that exhibits such a high heat resistance that neither detachment nor cracking would occur in a thermal shock test of cooling / heating cycle, etc., also exhibiting a low thermal expansibility and a flame retardance. There is provided a resin composition for use to form a resin layer of metal foil with resin or an insulating sheet layer of insulating sheet with base material, characterized by containing a cyanate resin and / or prepolymer thereof, an epoxy resin substantially not containing any halogen atoms, a phenoxy resin substantially not containing any halogen atoms, an imidazole compound and an inorganic filler. Further, there is provided a metal foil with resin, comprising a metal foil and, borne thereon, this resin composition. Still further, there is provided an insulating sheet with base material comprising a base material and, borne thereon, this resin composition. Still further, there is provided a multilayer printed wiring board obtained by superimposing this metal foil with resin or insulating sheet with base material on one or both major surfaces of inner layer circuit board and performing thermal compression molding thereof.

Description

technical field [0001] The present invention relates to a resin composition, a resin-adhered metal foil, a substrate-attached insulating board, and a multilayer printed circuit board. Background technique [0002] In recent years, with the increasing demand for high-performance electronic devices, the high-density integration of electronic components and the high-density assembly technology of electronic components have continued to develop, and the miniaturization of circuit boards for high-density assembly of the above-mentioned electronic devices and their High-density assembly technology is more advanced than ever. Laminated multilayer wiring boards are often used to solve the above-mentioned problem of high-density assembly of wiring boards or similar wiring boards (for example, see Japanese Patent Laid-Open H07-106,767 (1995)). [0003] A general laminated circuit board is formed by laminating an insulating layer consisting only of resin and having a thickness of 100 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/56B32B15/08H05K3/46B32B27/38
CPCH05K3/4652C08G59/56H05K3/4655B32B15/08C08G59/4014B32B27/20C08G59/08B32B27/38H05K2201/0358B32B27/28H05K2201/0209Y10T428/254Y10T428/31511Y10T428/31525Y10T428/31529Y10T428/31547C08K3/00C08L71/12C08L101/00C08L101/02
Inventor 新井政贵八月朔日猛若林宏彰
Owner SUMITOMO BAKELITE CO LTD
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