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Cyanate resin composition and application thereof

A technology of cyanate ester resin and cyanate ester prepolymer, which can be applied to other household appliances, synthetic resin layered products, applications, etc., and can solve the problems of decreased processability and increased resin melt viscosity

Inactive Publication Date: 2014-04-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Although the flame retardancy of naphthol biphenyl aralkyl type epoxy resin and naphthol naphthyl aralkyl type epoxy resin has been improved, the melt viscosity of the resin has increased and the processability has decreased.

Method used

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  • Cyanate resin composition and application thereof
  • Cyanate resin composition and application thereof
  • Cyanate resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0055] Synthesis example 1: Synthesis of naphthyl aralkyl type phenolic resin

[0056] Add 46 g of β-naphthol, 271 g of phenol, 215 g of dichloromethylnaphthalene and 300 g of chlorobenzene into the flask, slowly heat up and dissolve while stirring under nitrogen protection, and react at about 80° C. for 2 hours. Then, while distilling off chlorobenzene, the temperature was raised to 180°C, and the reaction was carried out at 180°C for 1 hour. After the reaction, the solvent and unreacted monomers were removed by distillation under reduced pressure to obtain a brown naphthyl aralkyl type phenolic resin. From the analysis of recovered unreacted monomers, the molar ratio of β-naphthol / (β-naphthol+phenol) entering the resin was 0.23.

Synthetic example 2

[0057] Synthesis example 2: Synthesis of naphthyl aralkyl type phenolic resin

[0058] Add 96 g of β-naphthol, 251 g of phenol, 150 g of dichloromethylnaphthalene and 450 g of chlorobenzene into the flask, slowly heat up and dissolve while stirring under nitrogen protection, and react at about 80° C. for 2 hours. Then, while distilling off chlorobenzene, the temperature was raised to 180°C, and the reaction was carried out at 180°C for 1 hour. After the reaction, the solvent and unreacted monomers were removed by distillation under reduced pressure to obtain a brown naphthyl aralkyl type phenolic resin. From the analysis of recovered unreacted monomers, the molar ratio of β-naphthol / (β-naphthol+phenol) entering the resin was 0.50.

Synthetic example 3

[0059] Synthesis example 3: Synthesis of naphthyl aralkyl type phenolic resin

[0060] Add 224g of β-naphthol, 272g of phenol, 100g of dichloromethylnaphthalene and 300g of chlorobenzene into the flask, slowly heat up and dissolve while stirring under nitrogen protection, and react at about 80°C for 2 hours. Then, while distilling off chlorobenzene, the temperature was raised to 180°C, and the reaction was carried out at 180°C for 1 hour. After the reaction, the solvent and unreacted monomers were removed by distillation under reduced pressure to obtain a brown naphthyl aralkyl type phenolic resin. From the analysis of recovered unreacted monomers, the molar ratio of β-naphthol / (β-naphthol+phenol) entering the resin was 0.70.

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Abstract

The invention relates to a cyanate resin composition, and a prepreg, laminated board, metal foil clad laminated board and printed circuit board prepared from the same. The cyanate resin composition comprises a cyanate resin (A) and an epoxy resin disclosed as Formula (I). The cyanate resin composition, and the prepreg, laminated board, metal foil clad laminated board and printed circuit board prepared from the cyanate resin composition have the advantages of favorable moisture resistance, favorable heat resistance, high flame retardancy, high reliability and low planar thermal expansion coefficient, and is suitable for substrate materials for manufacturing high-density printed circuit boards.

Description

technical field [0001] The invention relates to a resin composition, in particular to a cyanate resin composition and prepregs, laminates, metal foil-clad laminates and printed circuit boards prepared by using the composition. Background technique [0002] With the development of miniaturization, high performance, and high functionality of computers, electronics, and information communication equipment, higher requirements are placed on printed circuit boards: miniaturization, thinning, high integration, and high reliability. This requires metal-clad laminates for making printed wiring boards to have more excellent moisture resistance, heat resistance, reliability, and the like. [0003] At the same time, due to the increase in the packaging density of semiconductors, in order to reduce the problem of warpage generated during the packaging process, in recent years there has been a strong demand to reduce the thermal expansion coefficient of the laminate in the plane directio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08G59/40C08G73/06B32B15/092B32B27/04H05K1/03
CPCC08L63/04B32B15/092B32B27/04B32B2260/046B32B2307/3065B32B2363/00B32B2379/00B32B2457/08C08G59/4014C08G73/06C08L79/04C08L2201/02C08L2201/08C08L2203/20C08L2205/025C08L2205/03C08L2205/035H05K1/0366
Inventor 唐军旗许永静
Owner GUANGDONG SHENGYI SCI TECH
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