Semiconductor device

Abstract

The present invention provides a semiconductor device of which mass production is possible and the structure is different from that of a conventional small-size element. In addition, it is an object of the invention to provide a structure of a semiconductor device of which the strength can be improved, destruction of an element in manufacturing can be suppressed, and the reliability and yield are high, and a manufacturing method of the semiconductor device. The invention includes a layer having an integrated circuit, a first terminal which is formed over the layer having the integrated circuit and is electrically connected to the layer having the integrated circuit, a conductive layer which functions as an antenna, which is formed over the first terminal and is electrically connected to the first terminal, and a second terminal which is formed over the layer having the integrated circuit and is not electrically connected to the layer having the integrated circuit, the conductive layer which functions as the antenna, and the first terminal.

Description

Technical field [0001] The present invention relates to a semiconductor device mounted with a thin film integrated circuit, wherein the thin film integrated circuit has a memory, a microprocessor (central processing unit, MPU), etc. and is as thin as paper and has bending flexibility. The present invention also relates to a non-contact type semiconductor device with the thin film integrated circuit and antenna, which is mainly used to identify cards, labels, tags, etc., for people, animals, plants, commodities, banknotes, and the like. Background technique [0002] In recent years, research on semiconductor devices capable of transmitting / receiving data has been a hot spot. Such semiconductor devices are called IC chips, RF tags, wireless tags, electronic tags, wireless processors, wireless memories, and the like. Although most of the semiconductor devices that have been put into practical use are formed of single crystal silicon substrates. However, the commercialization of thin...

AI Technical Summary

Problems solved by technology

For this reason, the following problems arise, that is, the size of the antenna is limited in the semiconductor device with built-in antenna, and this will shorten the communication distance, etc.

In addition, there is a problem that the size and / or type of storage containers etc. are limited due to the limitation of the component area

[0009] Furthermore, when the element area is small, it is not possible to ensure a wide area for forming terminals. Therefore, in addition to the above-mentioned limitations, it is also necessary to find ways to provide terminals on the element with insulating layers interposed therebetween.

For this reason, there is a problem that the number of steps for manufacturing components will increase, which in turn becomes one of the main causes of yield reduction or cost increase

[0010] In addition, when the number of terminals is small, when the antenna material and the terminal are pressure-bonded, the load is concentrated on the terminal part and the element itself is damaged, or the load applied to each terminal is uneven, which is a major cause of yield reduction.

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