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Power electronic power device module

Inactive Publication Date: 2007-04-11
河北华整实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

As a result, the thermal resistance of the insulating board is increased and its heat dissipation performance is reduced; when the operating current of the device module reaches a certain value, the device module will be burned and scrapped due to insufficient heat dissipation
Therefore, the structure of the power electronic power device module in the prior art limits the improvement of the electric power of the device module, and cannot meet the requirements of modern production and engineering construction

Method used

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Embodiment Construction

[0016] The structure and operating principle of a power electronic power device module provided by the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0017] As shown in Figure 1, it is a schematic structural diagram of a power electronic power device module, including a base plate 1 of a heat dissipation component made of metal copper, aluminum or an alloy material, and as shown in Figure 2, there are two annular grooves on the base plate 2, 3, circular convex surfaces 4 and 5 are formed in the middle of the annular groove, and insulating plates 6 and 7 with heat dissipation function are respectively pasted on the two circular convex surfaces, and the pressing block 10 fixed by the screw rod 9, the casing 11. The electronic chip fixing part and the housing 14 composed of backing plate 19, disc spring 12 and pressing plate 13 fix the electronic chip 8 and insulating plate with rectification or other functions on the b...

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Abstract

This invention relates to a power electronic power device module including a base plate as the radiation plate, an insulation plate with heat radiation function, electronic chip adhered on the insulation plate, a fixing part for fixing the insulation plate and the electronic chip and a shell, a hump plane is set at the base adhered with the insulation plate and not larger than the shape and area of the insulation plate, which can increase the working current to 600A from 250A and working voltage to 4800V from the original 2000V without adding thickness of the insulation plate.

Description

technical field [0001] The invention belongs to the technical field of semiconductor power devices for power equipment, and in particular relates to a bottom plate made of metal materials, an insulating plate with a heat dissipation function, an electronic chip attached to the insulating plate, a pressing block fixed by a screw, a sleeve Electronic chip fixing parts composed of tubes, disc springs and pressure plates, and power electronic power device modules composed of housings. Background technique [0002] In modern production and engineering construction, the power of the power electronic equipment used is increasing, so the power of the required power electronic device modules is also increasing. At present, the structure of the used power electronic device module includes: a heat dissipation bottom plate made of metal materials, an electronic chip fixing part composed of a pressing block fixed by a screw, a bushing, a disc spring and a press...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H05K7/20
Inventor 宋晓飞宋希振
Owner 河北华整实业有限公司
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