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Vacuum deposition method and sealed-type evaporation source apparatus for vacuum deposition

A vacuum deposition and sealing technology, which is applied in vacuum evaporation plating, chemical instruments and methods, and from condensed steam, etc., can solve the problems that the temperature of the evaporation material does not increase, it is difficult to fill the evaporation material, and it is not easy to operate the sealed evaporation source. , to improve the yield

Inactive Publication Date: 2007-04-11
FUTABA CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, sealed evaporation sources cannot be easily handled compared to open evaporation sources
[0010] (4) In the sealed evaporation source, it is more difficult to refill the evaporation material during the evaporation process
However, since the evaporation phenomenon means a latent heat state in the non-evaporated evaporation material layer, the temperature of the evaporation material in the hold state does not increase

Method used

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  • Vacuum deposition method and sealed-type evaporation source apparatus for vacuum deposition
  • Vacuum deposition method and sealed-type evaporation source apparatus for vacuum deposition
  • Vacuum deposition method and sealed-type evaporation source apparatus for vacuum deposition

Examples

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Embodiment approach 1

[0083] Currently, when depositing, for example, a SiO (evaporation material) protective film on the surface of spectacle lenses, many lenses are arranged on the upper part of the vacuum chamber and an open type evaporation source is provided on the lower part thereof. Generally, the protective film is deposited on the lens surface by a resistive heater. In this case, the deposited lens is manually replaced with a new lens. Additionally, the evaporative material is manually refilled. There are many other labors for exchanging the substrate or the spectacle lens which is the substrate to be deposited and for refilling the evaporated material.

[0084] As for SiO (or evaporation material), there are various materials such as powder particles or flakes of several millimeters, precision-formed materials called targets, materials of irregular size or shape, and others. These evaporation materials are generally marketed by manufacturers. Apart from specific manufacturers, shaped a...

Embodiment approach 2

[0106] The second embodiment relates to a vacuum deposition method as shown in FIGS. 5-9 and a sealed type evaporation source device corresponding to the vacuum deposition method. This embodiment can be practically applied to the case of continuously producing a gas barrier film of sufficient length. Thus, for example, SiO is deposited by supplying oxygen gas while spraying SiO onto a synthetic resin film such as a polyester film.

[0107] 5 is a longitudinal sectional side view conceptually illustrating a schematic configuration of a sealed type evaporation source device for vacuum deposition according to a second embodiment of the present invention. Fig. 6 is a longitudinal sectional side view conceptually illustrating the state of the sealed evaporation source device shown in Fig. 5 after operating for a period of time. FIG. 7 is a schematic illustration of a cross-sectional view of a portion taken along line 7-7 in FIG. 6. FIG.

[0108] In each configuration of FIGS. 5-7...

Embodiment approach 3

[0120] The third embodiment corresponds to a variation of heating the container in the second embodiment.

[0121] 8 is a longitudinal sectional side view conceptually illustrating a schematic configuration of a sealed type evaporation source device for vacuum deposition according to a third embodiment. Fig. 9 is a longitudinal sectional view conceptually illustrating a modification of the sealed type evaporation source device.

[0122] In the sealed type evaporation source device 70 shown in FIG. 8, the heating container 71 has a straight cylindrical body, unlike the tapered container shown in the second embodiment. The heating vessel 71 is composed of an upper heating cylinder 72a and a lower heating cylinder 72b which can be divided vertically. Other constituent elements are the same as those in Embodiment Mode 2. In this case, the same numerals are assigned to the common constituent elements shown in FIGS. 8 and 9 .

[0123] In the sealed type evaporation source of the ...

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Abstract

A vacuum deposition method is provided. In the vacuum deposition for evaporating a sublimation evaporation material, the gas sealed-type heating container 11 has the blast aperture 14 and an area for evaporating the evaporation material by the radiation heat from the inner surface thereof. The holder 15 holds an evaporation material in a region in which the evaporation material does not evaluate due to the heat transferred from the heating container 11 . Thus, the generated vapor is emitted from the blast aperture 14 into the deposition subject surface outside the container.

Description

technical field [0001] The present invention relates to a vacuum deposition method and a sealed type evaporation source device for vacuum deposition of a sublimation material, which uses a sealed heating container having a blast aperture for the evaporation material. More particularly, the present invention relates to a vacuum deposition method employing a system for emitting and evaporating an evaporation material by utilizing a large pressure difference between a deposition chamber and a heating vessel. Furthermore, the present invention relates to a sealed type evaporation source device for vacuum deposition. By way of explanation, the evaporation material, heating vessel and associated components are collectively referred to as "sealed evaporation source". Background technique [0002] In general, an open-type evaporation source that does not utilize a pressure difference between an evaporation chamber and a heating chamber has been widely used as an evaporation source ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C30B23/06
CPCC30B23/066C23C14/246C23C14/24
Inventor 高木俊宣中村宏毅渡辺宽福田辰男
Owner FUTABA CORPORATION
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