Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photoelectric conversion substrate

A photoelectric conversion and substrate technology, which is applied in the direction of optical waveguide and light guide, can solve the problem of incompatibility between photoelectric conversion substrate and printed circuit board process, and achieve the effect of improving displacement tolerance, reducing production cost and increasing displacement tolerance

Inactive Publication Date: 2007-05-02
IND TECH RES INST
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Another object of the present invention is to provide a photoelectric conversion substrate, which can overcome the problem of incompatibility between existing photoelectric conversion substrates and printed circuit boards in terms of manufacturing process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photoelectric conversion substrate
  • Photoelectric conversion substrate
  • Photoelectric conversion substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 3 is a cross-sectional view of Embodiment 1 of the photoelectric conversion substrate 1 of the present invention. The two end faces 123 of the at least one honeycomb micro-optical waveguide 12 each have at least one pair of alignment structures or alignment marks (not marked), wherein the At least one pair of alignment structures or alignment marks are aligned and optically connected to the photoelectric element 13, so that the displacement tolerance of the photoelectric element 13 on the package of the photoelectric conversion substrate 1 and the number of array channels can be increased, and in The end face 123 of the honeycomb micro-optical waveguide 12 has an asymmetric structure, which is beneficial to the alignment during wiring. Since this structure is applied under the structure of an M×N array, in order to avoid the When the structure is twisted during wiring, the 1-to-1 correspondence between the Tx Channel and the Rx Channel is misplaced. The asymmetric struct...

Embodiment 2

[0039] Fig. 4 is a schematic diagram of Embodiment 2 of the photoelectric conversion substrate 1 of the present invention, where the difference from Fig. 1 is that the photoelectric conversion substrate 1 of the present invention has a plurality of honeycomb micro-optical waveguides 12, wherein the honeycomb micro-optical waveguides 12 are connected to each other It can cross each other, it can realize three-dimensional multi-channel structure and because the structure of the honeycomb micro-optical waveguide 12 can allow more channel transmission per unit area, it is not limited by the Pitch 250mm of the optical fiber, so in The pitch of the VCSEL element can be less than 250mm. In other words, there can be more VCSEL elements per unit area on the VCSEL wafer.

Embodiment 3

[0041] Please refer to FIG. 5, which is a schematic diagram of Embodiment 3 of the photoelectric conversion substrate 1 of the present invention. The difference from FIG. The photoelectric conversion substrate 1 of the optical waveguide 12, wherein the optical component sub-module 2 integrates a photoelectric component and an IC driving component.

[0042] In summary, the structure of the photoelectric conversion substrate 1 disclosed by the present invention is easy to manufacture, can reduce production costs, overcomes the problem of incompatibility between existing photoelectric conversion substrates and printed circuit boards, and can effectively increase the number of photoelectric elements in the photoelectric conversion substrate. Displacement tolerance on the package.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A base plate of photoelectric conversion consists of a base plate with cellular optical microwave guide being buried in base plate and exposing its two end surfaces out, multiple photoelectric element set on base plate and connected to two said end surfaces, multiple IC driving element set on base plate and electric-connected to said photoelectric element for utilizing cellular optical microwave guide to transmit light signal.

Description

technical field [0001] The invention relates to a photoelectric conversion substrate, in particular to a photoelectric conversion substrate with a honeycomb micro-optical waveguide structure with optical interconnection technology. Background technique [0002] With the development of optical communication component technology and the system moving towards high-speed broadband, the construction technology must meet the requirements of light and thin or high reliability construction environment, and due to the growth of the Internet (Internet), people's demand for network bandwidth is increasing. With the increase, the optical fiber network is becoming more and more large-capacity, multi-variable, high-reliable and economically effective. Optical communication is no longer limited to long-distance communication, optical networking (Optical Networking) is realized step by step, and the structure of optical fiber network is gradually formed. In order to achieve the goal of hig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/12
Inventor 陈颖志朱彦李顺天田珮徐国原
Owner IND TECH RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com