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Photoelectric conversion substrate

A technology of photoelectric conversion and substrate, applied in the direction of optical waveguide and light guide, can solve the problem of incompatibility between photoelectric conversion substrate and printed circuit board process, and achieve the effect of improving displacement tolerance, high production cost, and increasing displacement tolerance.

Inactive Publication Date: 2008-08-20
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Another object of the present invention is to provide a photoelectric conversion substrate, which can overcome the problem of incompatibility between existing photoelectric conversion substrates and printed circuit boards in terms of manufacturing process

Method used

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  • Photoelectric conversion substrate
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Experimental program
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Effect test

Embodiment 1

[0036] image 3 It is a cross-sectional view of Embodiment 1 of the photoelectric conversion substrate 1 of the present invention. The two end faces 123 of the at least one honeycomb-shaped micro-optical waveguide 12 each have at least one alignment structure or alignment mark (not shown), wherein the at least one The alignment structure or the alignment mark is aligned and optically connected to the photoelectric element 13, so the displacement tolerance of the photoelectric element 13 on the photoelectric conversion substrate 1 package and the number of array channels can be increased, and in the honeycomb The end face 123 of the honeycomb-shaped micro-optical waveguide 12 has an asymmetric structure, which is beneficial to the alignment during wiring. Since this structure is applied in the structure of the M×N array, in order to avoid the structure of the honeycomb-shaped micro-optical waveguide 12 When the wiring is twisted, the 1-to-1 correspondence of the Tx Channel and ...

Embodiment 2

[0039] Figure 4 It is a schematic diagram of Embodiment 2 of the photoelectric conversion substrate 1 of the present invention, wherein the figure 1 The difference is that the photoelectric conversion substrate 1 of the present invention has a plurality of honeycomb-shaped micro-optical waveguides 12, wherein the honeycomb-shaped micro-optical waveguides 12 can span each other, it can realize a three-dimensional multi-channel structure, and due to the honeycomb-shaped micro-optical waveguides 12 The structure of the micro-optical waveguide 12 can allow more channel transmission per unit area, so it is not limited by the pitch of the optical fiber 250mm, so the pitch of the VCSEL element can be less than 250mm, in other words, within the unit area of ​​the VCSEL Wafer Can have more VCSEL components.

Embodiment 3

[0041] see Figure 5 , which is a schematic diagram of Embodiment 3 of the photoelectric conversion substrate 1 of the present invention, wherein the Figure 4 The difference is that the present invention applies a plurality of optical element sub-modules 2 to the photoelectric conversion substrate 1 having a plurality of honeycomb-shaped micro-optical waveguides 12 of the present invention, wherein the optical element sub-module 2 integrates optoelectronic elements and IC drivers. element.

[0042] To sum up, the structure of the photoelectric conversion substrate 1 disclosed in the present invention is easy to manufacture and can reduce the production cost, overcomes the problem of incompatibility between the existing photoelectric conversion substrate and the printed circuit board in the manufacturing process, and can effectively increase the number of photoelectric elements on the photoelectric conversion substrate. Displacement tolerance on package.

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Abstract

A base plate of photoelectric conversion consists of a base plate with cellular optical microwave guide being buried in base plate and exposing its two end surfaces out, multiple photoelectric element set on base plate and connected to two said end surfaces, multiple IC driving element set on base plate and electric-connected to said photoelectric element for utilizing cellular optical microwave guide to transmit light signal.

Description

technical field [0001] The present invention relates to a photoelectric conversion substrate, in particular to a photoelectric conversion substrate with a honeycomb micro-optical waveguide structure with optical interconnection technology. Background technique [0002] With the development of optical communication component technology, with the system moving towards broadband and high speed, the packaging technology must meet the requirements of light, thin, short or high reliability. In recent years, fiber optic networks are increasingly developing towards large capacity, multi-variation, high reliability and cost-effectiveness. Optical communication is no longer limited to long-distance communication. Optical Networking is realized step by step, and the optical fiber network structure is gradually formed. In order to achieve the goal of high-speed and popularization of optical communication, it is necessary to establish low-cost optoelectronic packaging technology, develo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/12
Inventor 陈颖志朱彦李顺天田珮徐国原
Owner IND TECH RES INST
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