Composition of a solder, and method of manufacturing a solder connection
A technology of composition and solder, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of increased complexity and poor solderability
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[0049] The drawings are not drawn to scale, and the same reference numbers in different drawings refer to the same parts.
[0050] Figure 1 shows a schematic cross-sectional view of a prior art substrate. The substrate is an integrated circuit device. It includes multiple elements, in this case MOS transistor 2 and polysilicon track 3. The circuit is provided in an active circuit area 4 on the surface of the semiconductor body 1. In the coverage relationship related to the circuit devices 2, 3, an interconnection structure 8 is provided for interconnecting the circuit devices 2, 3 to form a circuit. In this embodiment, the interconnection structure 8 includes a first patterned metal layer 5, a second patterned metal layer 6 and an interconnection via 7. In this example, the patterned metal layers 5, 6 include aluminum or aluminum alloy, such as AlCu. A layer of passivation material 9 is arranged on the interconnect structure 8. The passivation material is for example silicon nitri...
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