Radiator

Abstract

A heating radiator comprises a base touched with heat source, and a number of the first-level radiating fins upwardly-extending from the said base, and a heat-transfer element connected with the base for heat conduction and the first-level radiating fins lining up beside the two-side of the heat-transfer element, and a number of the second-level radiating fins extending from the contrary two-side of the heat-transfer element and perpendicular to the first-level radiating fins, and a heat pipe connecting the said base and the said heat-transfer element in order to transfer heat from the former to the latter. The invention mounts two set perpendicular radiating fins, so the smaller size of radiating fins turns into the bigger radiating area as a whole, and it increases the efficiency of the single radiating fins to improve the radiating performance.

Description

【Technical field】 [0001] The invention relates to a cooling device, in particular to a radiator used on electronic components. 【Background technique】 [0002] Radiators have become an essential configuration for high-heat-generating electronic components such as central processing units. With the continuous and rapid development of integrated circuit technology, the functions of electronic components are becoming more and more powerful, and their performance is also continuously improving. The heat is also increasing. An efficient radiator is very important to ensure the normal operation of electronic components. In order to dissipate heat from electronic components in a timely and effective manner, radiators of various structures are constantly being designed. [0003] A typical aluminum extruded heat sink usually includes a flat base, the bottom surface of the base is used to contact the electronic components to absorb heat, and the top surface extends vertically with a n...

AI Technical Summary

Problems solved by technology

In order to improve the heat dissipation capacity of this radiator, the simple principle is to increase the heat dissipation area. The most direct way is to increase the size of the heat dissipation fins. However, due to the limitation of aluminum extrusion manufacturing, the aspect ratio of the fins exceeds a certain ratio ( Usually 13:1), the fins are easily deformed or broken, so increasing the fin area requires correspondingly increasing the fin pitch, thus reducing the number of heat dissipation fins under the same volume, and the overall heat dissipation area is not significant Increase

On the other hand, excessive size will lead to a reduction in the utilization of the fins, especially the edge of the fins away from the base due to insufficient heat and less external heat dissipation, so the large-volume radiator occupies more space inside the computer system. More space resources, but the heat dissipation performance has not been improved to a corresponding extent

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