Encapsulation structure of optical sensor

Abstract

This invention relates to one light sensor sealing structure by use of metal distribution and adhesive layer baseboard to fix the sensor onto baseboard and to change electricity path of sealing structure from COG process into CIS process to improve electricity rate, wherein, it forms gap wall to block glue overflow in proper position to avoid pollution by overflow and metal ball. This invention can reduce sealing area to improve good rate and quality.

Description

technical field [0001] The present invention relates to a light sensor package structure, in particular to a light sensor CIS package structure. Background technique [0002] With the prevalence of audio-visual multimedia, image digitization has become an inevitable trend. The launch of digital cameras, digital video cameras and image scanners and other products represents the advent of the digital image era, and CMOS is one of the important technologies that determine this digital age. The quality, cost, and humanization of its products are the key to the success or failure of an enterprise in this competition. [0003] Please refer to FIG. 1, which is a COG packaging structure of an existing CMOS photosensor (CMOS image sensor). Metal balls (solder balls) 14 for forming electrical connections with metal wiring 12; an optical sensing component 16, which includes a photo-sensing region (sensing region) 18, a plurality of welding pads 20 (pads), on which A plurality of meta...

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a light sensor packaging structure, which is a light sensor exhibiting a CIS package structure, which can solve the problem of colloidal layer contamination of metal balls under the trend of light, thin, short, and small light sensors. Problems with the light sensing area, and greatly improve the yield of light sensor packaging

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