Hypoeutectic no-lead SnZn alloy brazing alloy

A technology of hypoeutectic tin-zinc and lead-free solder, which is applied in metal processing equipment, welding/cutting medium/material, welding medium, etc., can solve problems such as ignoring the research of Sn-6.5Zn alloy, and achieve practicality, The effect of simplifying the process

Inactive Publication Date: 2007-06-06
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0021] Because the Sn-9Zn alloy is the eutectic point of the Sn-Zn alloy, the existing research is almost all around Sn-9Zn. The previous techn

Method used

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  • Hypoeutectic no-lead SnZn alloy brazing alloy

Examples

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Embodiment 1

[0046] (1) hypoeutectic tin-zinc alloy-based lead-free solder, wherein: the zinc content of the hypoeutectic tin-zinc alloy-based lead-free solder is 6.5% of the total weight of the alloy, and the content of phosphorus is 0.5% of the total weight of the alloy, The rest is tin.

[0047] (2) hypoeutectic tin-zinc alloy-based lead-free solder, wherein: the zinc content of the hypoeutectic tin-zinc alloy-based lead-free solder is 9.0% of the total weight of the alloy, and the phosphorus content is 0.5% of the total weight of the alloy, The rest is tin.

[0048] Take the melted Sn-6.5 and 9.0%wt Zn alloy as the base material, take 100 grams each of the two base materials and melt them in a corundum crucible in a resistance furnace and heat up to 370°C. The surface is protected with graphite powder and wrapped with tin foil. Each 0.5 g of red phosphorus powder was quickly pressed into the melt and stirred, kept warm for 10 minutes and then cooled down to 300 °C, and cast into a φ5 ...

Embodiment 2

[0051] (1) Hypoeutectic tin-zinc alloy-based lead-free solder, wherein: the zinc content of the hypoeutectic tin-zinc alloy-based lead-free solder is 2.5% of the total weight of the alloy, and the rest is tin.

[0052] (2) Hypoeutectic tin-zinc alloy-based lead-free solder, wherein: the zinc content of the hypoeutectic tin-zinc alloy-based lead-free solder is 4.5% of the total weight of the alloy, and the rest is tin.

[0053] (3) Hypoeutectic tin-zinc alloy-based lead-free solder, wherein: the zinc content of the hypoeutectic tin-zinc alloy-based lead-free solder is 6.0% of the total weight of the alloy, and the rest is tin.

[0054] (4) Hypoeutectic tin-zinc alloy-based lead-free solder, wherein: the zinc content of the hypoeutectic tin-zinc alloy-based lead-free solder is 6.5% of the total weight of the alloy, and the rest is tin.

[0055] (5) Hypoeutectic tin-zinc alloy-based lead-free solder, wherein: the zinc content of the hypoeutectic tin-zinc alloy-based lead-free sol...

Embodiment 3

[0060] The hypoeutectic tin-zinc alloy-based lead-free solder, wherein the zinc content of the hypoeutectic tin-zinc alloy-based lead-free solder is 6.3% of the total weight of the alloy, and the rest is tin. All the other are with embodiment 2.

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Abstract

The present invention relates to one kind of hypoeutectic no-lead SnZn brazing alloy. The hypoeutectic no-lead SnZn brazing alloy contains Zn in 6.3-6.6 wt% and P in 0.0-0.6 wt% except Sn. Experiments show that Sn-6.3Zn, Sn-6.5Zn and Sn-6.6Zn alloys have copper wetting power higher than that of Sn-9Zn, Sn-6Zn and Sn-7Zn alloys, are superior to Sn-9Zn alloy in copper wetting power, antioxidant performance, structure and weld interface structure and creep strength, and have practical smelting point the same as that of Sn-9Zn alloy. Therefore, the Sn-6.5Zn alloy has simplified technological process and is practical.

Description

technical field [0001] The invention relates to a brazing material for electronic devices, which belongs to non-ferrous alloy materials, and relates to the restriction of modern environmental protection regulations on traditional lead-containing brazing materials and the development of new high-performance electronic solders, especially a hypoeutectic tin-zinc Alloy-based lead-free solder. Background technique [0002] Various electronic devices, including microelectronic devices, generally use brazing as a means of circuit connection and assembly. For a long time, Sn-Pb eutectic and near-eutectic alloys have been used as Brazing materials are widely used. With the expansion of the production and application scale of electronic products, the acceleration of replacement and the enhancement of human environmental protection awareness, the potential harm of lead in a large number of discarded electronic products to the environment and human body has aroused great concern from ...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 魏秀琴周浪黄惠珍谭敦强
Owner NANCHANG UNIV
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