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Cleaning-free soldering flux without halogen and rosin for solder without lead

A lead-free solder, halogen-free technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of incompatibility of no-cleaning welding process, achieve superior soldering performance, eliminate cleaning process, Safe to use

Inactive Publication Date: 2009-06-10
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a no-clean flux that can be effectively used with lead-free solder in view of the incompatibility of the existing water-soluble flux for lead-free solder to the no-clean soldering process

Method used

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  • Cleaning-free soldering flux without halogen and rosin for solder without lead

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Succinic acid 2.0

[0030] Glutaric acid 0.6

[0031] Salicylic acid 1.2

[0032] Tartaric acid 0.1

[0033] Citric acid 0.8

[0034] OP emulsifier 0.1

[0035] Glycerol 16.0

[0036] Ethylene glycol monobutyl ether 12.0

[0037] PEG-400 0.5

[0038] Benzotriazole 0.1

[0039] Deionized water 57.6

[0040] Preparation method:

[0041] Add co-solvent and part of deionized water into the reaction kettle with agitator first, add film-forming agent under stirring, add the remaining amount of deionized water, activator and surfactant after dissolving, then add corrosion inhibitor, stir until The solid matter is completely dissolved, the materials are mixed evenly, and the filtrate is retained after static filtration to obtain the flux of the present invention.

Embodiment 2

[0043] Salicylic acid 1.5

[0044] Succinic acid 1.5

[0045] Adipic acid 0.2

[0046] Tartaric acid 0.2

[0047] Lactic acid 1.0

[0048] TX-10 0.2

[0049] Glycerol 18.0

[0050] Diethylene glycol 4.0

[0051] Ethylene glycol monobutyl ether 15.0

[0052] PEG-600 0.5

[0053] Benzotriazole 0.1

[0054] Deionized water 57.8

[0055] The preparation and use methods are the same as in Example 1.

Embodiment 3

[0057] DL-malic acid 1.8

[0058] Tartaric acid 0.2

[0059] Citric acid 0.5

[0060] Lactic acid 0.5

[0061] OP emulsifier 0.3

[0062] Glycerol 18.0

[0063] Diethylene glycol ether 15.0

[0064] PEG-400 0.5

[0065] Triethylamine 0.1

[0066] Deionized water 63.1

[0067] The preparation and use methods are the same as in Example 1.

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Abstract

A flux without halogen, rosin and washing for Pb-free solder contains activating agent (8.0-15.0 Wt %), cosolvent (28-40), filming agent (0.1-1.0), corrosion retardant (0.1-0.5) and the solvent and deionized water (rest).

Description

technical field [0001] The invention relates to a soldering flux, in particular to a halogen-free and rosin-free soldering flux suitable for lead-free solder. Background technique [0002] Due to the requirements of global environmental protection regulations and the development of the electronic industry, lead-free electronic products are an inevitable trend. At present, the lead-free solders that are more researched and initially commercialized in the world are Sn-Ag and Sn-Ag-Cu eutectic alloys. However, in the process of research and use, it was found that compared with traditional Sn-Pb solder, lead-free solder has poor wettability, is easy to oxidize, and has a high melting point. The increase of the melting point means that the soldering temperature must be increased. On the one hand, it will cause damage to the components on the board surface. On the other hand, it will inevitably increase the volatilization of the active agent in the flux, which is likely to cause ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/36
Inventor 雷永平徐冬霞夏志东张冰冰李国伟周永馨祝蕾郭福史耀武
Owner BEIJING UNIV OF TECH
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