RE no-lead welding alloy for wave soldering

A lead-free solder alloy, wave soldering technology, used in welding/cutting media/materials, welding media, welding equipment, etc. Inhibition of dissolution, excellent brazing properties, and the effect of reducing the amount of generation

Inactive Publication Date: 2007-06-06
ZHUZHOU SITE NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a rare earth lead-free solder alloy for wave soldering, which can solve the problems of easy oxidation of the surface of the solder pot, bridging of solder joints and insufficient wettability of the Sn-Cu series lead-free solder alloy during use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The lead-free solder alloy of the present embodiment is composed of the following components by weight percentage: Cu0.7, P0.001, Ni0.1, Ce0.05, the balance Sn, processed into solder bar for wave soldering, used for PCB assembly, surface No oxidation, good solderability, long service life of solder, no bridging of solder joints, good wetting and spreading properties.

Embodiment 2

[0015] The lead-free solder alloy of the present embodiment is composed of the following components by weight percentage: Cu0.5, P0.005, Ni1.0, Er0.1, the balance Sn, processed into a solder bar for wave soldering, used for PCB assembly, surface No oxidation, good solderability, long service life of solder, no bridging of solder joints, good wetting and spreading properties.

Embodiment 3

[0017] The lead-free solder alloy of the present embodiment is made up of the following composition of weight percent: Cu0.7, P0.01, Ni0.5, Ce0.001, surplus Sn, be processed into solder wire, be used for PCB assembly, surface No oxidation, good solderability, long service life of solder, no bridging of solder joints, good wetting and spreading properties.

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PUM

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Abstract

The RE no-lead soldering alloy for wave soldering is one kind of environment friendly no-lead soldering material for soft soldering. It consists of Cu 0.1-2.5 wt%, P 0.001-1.0 wt%, Ni 0.01-1.5 wt%, RE elements Ce, Er and / or Y 0.001-1 wt%, and Sn for the rest. It is superior to available Sn-Cu no-lead soldering alloy, which has excessive metal oxide in the surface of soldering material pot, poor soldering point bridging, poor wetting and other demerits. It may be processed into soldering rod, soldering wire, soldering ball, etc. for PCB assembling, SMT, etc.

Description

technical field [0001] The invention relates to a lead-free solder alloy, in particular to a lead-free solder alloy for wave soldering. Background technique [0002] Sn-Pb alloy has become a typical solder alloy for electronic packaging and assembly in the current electronics industry due to its excellent wettability, solderability, electrical conductivity, mechanical properties, and low cost. However, Pb and Pb-containing compounds are toxic and harmful substances that endanger human health and pollute the environment. At present, Japan, the European Union and the United States have successively formulated their own lead-free solder processes. The WEEE (Waste Electrical and Electronic Equipment) and RoHS (Resbiction of Hazrdous Subsfances) directives mandate that since July 1, 2006, they will be sold in European markets. The electronic products are quite lead-free electronic products. Among the existing lead-free solder alloys for wave soldering, the Sn0.7Cu eutectic allo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/02
Inventor 刘梓旗刘梓葵
Owner ZHUZHOU SITE NEW MATERIAL
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