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Process for producing inductive coil by printed circuit board

A technology for printed circuit boards and inductance coils, which is used in the assembly of printed circuits with electrical components, coil manufacturing, and signal inductance without a magnetic core. It can solve the problems of cumbersome processes, high costs, and large differences in inductance , to achieve uniform inductance, improve performance, and shorten the production cycle.

Inactive Publication Date: 2007-06-27
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Abstract
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Problems solved by technology

The inductance coil L of the traditional eddy current sensor is affected by the winding method or the winding process, and the processing accuracy of the skeleton. The inductance of the same number of turns of the same wire wound inductance coil L is quite different.
At the same time, when the wire with small wire diameter is used to manually wind the inductance coil L, the process is more cumbersome and the cost is higher

Method used

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  • Process for producing inductive coil by printed circuit board

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Embodiment Construction

[0017] The inductance coil L is the sensitive element of the eddy current sensor, and its performance parameters directly affect the static and dynamic performance of the eddy current sensor. As shown in Figure 1, it is an inductance coil of a traditional eddy current sensor. This kind of inductance coil is troublesome to wind, and the inductance of the processed inductance coil is not uniform. Make the inductance coil on the printed circuit board, first design a multi-layer circuit board, and design a spiral coil on each layer, and design the number of turns of the coil according to the different requirements for the inductance of the inductance coil and wire size. The two adjacent layers of coils on the circuit board are connected to each other through buried holes and through holes on the printed circuit board. The winding direction of the adjacent two layers of coils is shown in Figure 2. The first layer of coils 1 is clockwise from outside to inside. Winding, when windin...

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Abstract

This invention relates to a method for manufacturing inductance coils with PCB including: producing a PCB of 2-20 layers and making a screw coil on each layer CB, designing coil turns and coil diameter according to the inductance, winding adjacent two layers of coils in opposite direction and connecting the adjacent two layers of coils with buried holes through through holes of the CB to ensure the same direction of alternating magnetic fields generated by the two adjacent layers of coils till to the last layer.

Description

1. Technical field [0001] The invention belongs to a process method for manufacturing inductance coils by using printed circuit board technology. 2. Background technology [0002] A main component of the eddy current displacement sensor is a flat inductance coil L, which is connected in parallel with a capacitor C to form a parallel resonant circuit. A high-frequency signal is used to excite the parallel circuit, and a high-frequency alternating magnetic field is generated on the inductance coil L. When the measured conductor is close to the sensor, an eddy current intersecting with the alternating magnetic field will be generated on the surface of the conductor within the range of the alternating magnetic field, and the eddy current will generate an alternating magnetic field to hinder the change of the external magnetic field. The size of the inductance of the inductance coil L is changed, and the degree of change depends on the size of the inductance coil L, the distance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/02H01F41/04H05K3/30
Inventor 徐龙祥金超武
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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