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Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure

A technology for installing flexible wiring substrates and electronic components, which is applied in the field of law and can solve the problems of complex patterning steps and increased technical difficulty.

Inactive Publication Date: 2007-06-27
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the technical difficulty is greatly increased because the composition steps become complicated

Method used

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  • Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure
  • Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure
  • Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure

Examples

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no. 1 example

[0030] 2A to 2I are cross-sectional views showing a method of manufacturing a flexible wiring substrate according to a first embodiment of the present invention. In the method of manufacturing a flexible wiring substrate according to the first embodiment of the present invention, as shown in the upper view of FIG. . As shown in the lower view of FIG. 2A, the tape substrate 10 is composed of a resin layer 10a and a reinforcing metal layer 10b provided on the lower surface of the resin layer 10a. For example, the resin layer 10 a is formed of a polyimide layer with a film thickness of about 25 μm, and the reinforcing metal layer 10 b is formed of a copper foil with a film thickness of 15 to 18 μm.

[0031] In a state where tension is applied to the tape-shaped substrate 10 by the roller 6 (unwinding process), the tape-shaped substrate 10 is pulled out from the reel 5 and transported to various manufacturing systems 7 (reel-to-reel system), and then processed on the tape A wiri...

no. 2 example

[0056] 4A to 4C are cross-sectional views showing a method of manufacturing a first electronic component mounting structure according to a second embodiment of the present invention. In the second embodiment, the manner of mounting electronic components on a flexible wiring substrate will be described below based on the technical idea of ​​the method for manufacturing a flexible wiring substrate of the present invention. In the second embodiment, the same reference numerals are assigned to the same elements as those of the first embodiment, and their descriptions are omitted here.

[0057] First, as shown in FIG. 4A, predetermined build-up wiring layers are formed on the tape substrate 10 by a method similar to that of the first embodiment. In FIG. 4A , like the first embodiment, an example in which the first wiring pattern 16 and the second wiring pattern 26 are stacked on the tape-shaped substrate 10 is illustrated. Then, the solder resist film 22 is formed in which the ope...

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PUM

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Abstract

A method of manufacturing a flexible wiring substrate of the present invention includes the steps of preparing a tape-like substrate composed of a resin layer and a reinforcing metal layer provided on its lower surface, then forming a via hole whose depth reaches the reinforcing metal layer by processing the resin layer of the tape-like substrate by the laser, and then forming a wiring pattern which is connected to the reinforcing metal layer through the via hole on the resin layer by the semi-additive process, wherein the reinforcing metal layer is patterned to constitute a connection pad connected to the wiring pattern or is removed.

Description

technical field [0001] The present invention relates to a method of manufacturing a flexible wiring substrate and a method of manufacturing an electronic component mounting structure, more particularly, the present invention relates to a method of manufacturing a flexible wiring that can be applied to a tape-carrying package such as a tape-carrying BGA, a tape-carrying CSP, etc. A substrate method, and a method of manufacturing an electronic component mounting structure for mounting electronic components on the wiring substrate. Background technique [0002] In the prior art, there are tape mount packages such as tape mount BGA (Ball Grid Array), tape mount CSP (Chip Scale Package), etc. using polyimide tape as a substrate. In an example of a method of manufacturing a tape carrier package in the prior art, as shown in FIG. 1A , first, a polyimide tape 100 is prepared, on both surface sides thereof, an upper Cu layer 102a and a lower Cu layer 102b are respectively provided. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/46H05K13/04H01L23/12
CPCH01L23/4985H01L21/486H05K1/0393H05K3/205H05K3/108H01L23/3121H05K2203/0384H05K3/4007H01L2224/48227H05K2201/0367H05K3/4644H05K2201/09563H05K3/421H01L2224/48228H01L2924/19041H01L2224/16225H05K3/28H05K2201/0394H05K3/30
Inventor 野村智弘
Owner SHINKO ELECTRIC IND CO LTD