Polyester resin compositions with reduced emission of volatile organic compounds

A resin composition, the technology of the composition, applied in the field of low profile additives, low VOC products and parts, A-type SMC mixture, unsaturated polyester field, can solve the problem of unable to reduce VOC emissions and so on

Inactive Publication Date: 2007-06-27
DSM IP ASSETS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, current SMC- / BMC technologies cannot further reduce VOC emissions

Method used

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  • Polyester resin compositions with reduced emission of volatile organic compounds
  • Polyester resin compositions with reduced emission of volatile organic compounds
  • Polyester resin compositions with reduced emission of volatile organic compounds

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0098] Example 1) SMC with LP-polyester modified by Desmodur TT-G, based on 0.9 parts Trigonox 117 and tempered board (190°C, 30 minutes)

[0099] Headspace measurement conditions:

[0100] Sample size: 0.5×0.5cm

[0101] Sample mass: 300mg

[0102] Number of samples measured: 3

[0103] Temper the SMC board at 190°C for 30 minutes

[0104] Prepare various SMC compositions with different uretdione component contents according to the components shown in Table 1, just adopt the amount of uretdione component in the preparation process of LPA-A component to make the urea in the SMC composition The diketone content reached the expected value.

[0105] table 3:

[0106] Desmodur TT

[0107] 3 shows that tempering reduces the concentration of styrene below the detection limit. If 0.4 or 0.5 part of Desmodur TT-G is incorporated into the LP-polyester, so is ethylhexanol. Because of the high vapor pressure, the concentrations of tert-butanol and acetone are signifi...

Embodiment 2

[0108] Example 2) Desmodur TT-G is added to the SMC of the formulation as a separate component, based on 0.9 Part Trigonox 117 and tempered plate (19°C, 30 minutes)

[0109] Headspace test conditions such as embodiment 1

[0110] Table 4:

[0111] Desmodur TT

[0112] From the above results it is known that the addition of Desmodur TT-G (as a separate component) to the SMC formulation results in less reduction in ethyl hexanol. Therefore, it is even more effective to incorporate Desmodur TT into the LP-Polyester.

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Abstract

Thermally curate resin composition, having shrink-controlled properties and being suitable for use in sheet moulding compounds and bulk moulding compounds (SMCs and BMCs) comprising, inter alia (a)an unsaturated polyester; (b) an alkenyl aromatic monomer; (c) a low profile additive; (d) a peroxide initiator; (e) a thickening agent; (f) fibrous reinforcement material; and optionally one or more components selected from the group of (g) mould release agents; (h) wetting and viscosity reducing agents; and (i) fillers, wherein the composition also comprises a uret dione diisocyanate, in an amount of at least 0,2-1,0% by weight relative to the total weight of components (a), (b) and (c) of the resin composition. The resin compositions according to the invention in particular have a low emission of volatile organic compounds (VOC). More particularly, the resin compositions have excellent Class A properties. The present invention also relates to low profile additives (LPAs) wherein a uret dione diisocyanate is chemically attached through one or both of its reactive side-chain isocyanate groups to one or more of the OH-, NH2-, or COOH- groups of a component already having LPA properties. Finally, the present invention relates to low-VOC products and parts produced from the SMCs and BMCs according to the invention.

Description

Background technique [0001] The present invention relates to a thermosetting resin composition having controlled shrinkage properties suitable for use in sheet molding compounds and bulk molding compounds (SMC and BMC), comprising: (a) Unsaturated polyester; (b) alkenyl aromatic monomer; (c) low profile additive (hereinafter also referred to as LPA); (d) peroxide initiator; (e) thickener; (f) fiber a reinforcing material; and optionally one or more other components selected from (g) mold release agents; (h) wetting and viscosity reducing agents and (i) fillers. Thermosetting (ie, thermosetting) resin composition A resin composition that can be cured by subjecting the resin composition to heat treatment. In particular, the resin composition according to the present invention has a low emission of volatile organic components (hereinafter also referred to as VOC). More specifically, the present invention relates to such thermosetting resin compositions having Class A properties...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G63/00C08G63/88C08K5/00C08K5/3442
CPCC08K5/3442C08J2367/06C08J5/18C08L67/06
Inventor 约翰内斯·温德利纽斯·休伯图斯·汉德利斯瑞恩哈德·洛伦兹斯特凡·汉根勃格乔格·布恩凯埃里克·路德达拉·格尔斯
Owner DSM IP ASSETS BV
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