Electro-optical device, manufacturing method thereof, and electronic apparatus
An electro-optical device and manufacturing method technology, which are applied in identification devices, optics, nonlinear optics, etc., can solve the problems of low moisture resistance, low interface tightness, etc., and achieve improved moisture resistance, tightness, and peeling prevention. Effect
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no. 1 Embodiment approach
[0109] First, a first embodiment of the present invention will be described.
[0110] 1 is a plan view showing a liquid crystal device according to a first embodiment; FIG. 2 is a cross-sectional view of the liquid crystal device taken along line II-II in FIG. 1 .
[0111] As shown in FIG. 1 and FIG. 2 , the liquid crystal device 100 includes, for example, a TFT substrate 10 that is a first substrate such as a quartz substrate, a glass substrate, or a silicon substrate, and a TFT substrate 10 that is disposed opposite to the TFT substrate 10. The internal space between the counter substrate 20 which is a second substrate such as a glass substrate or a quartz substrate is composed of a liquid crystal 50 which is an electro-optic substance. The opposed TFT substrate 10 and counter substrate 20 are bonded together with a sealing material 52 .
[0112] On the surface of the TFT substrate 10 that is in contact with the liquid crystal 50 , a display region 10 h of the TFT substrate...
no. 2 Embodiment approach
[0148] Next, a second embodiment of the present invention will be described.
[0149] 8 is a front view showing an outline of the structure of a TFT substrate of a liquid crystal device according to a second embodiment of the present invention; FIG. 9 is a partial cross-sectional view of the TFT substrate along line IX-IX in FIG. 8 .
[0150] The configuration of the liquid crystal device of this embodiment is different from the liquid crystal device 100 of the first embodiment shown in FIGS. 60 tight-fitting compositions. Therefore, only the point of difference will be described, and the same reference numerals will be attached to the same configuration as the first embodiment, and the description will be omitted.
[0151] Also, in FIG. 8 and FIG. 9, the light-shielding film 53, the data line drive circuit 101, the external connection terminal 102, the scan line drive circuits 103, 104, the wiring 105, the up and down conduction material 106, and the up and down conduction t...
no. 3 Embodiment approach
[0170] Next, a third embodiment will be described.
[0171] 16 is a partial cross-sectional view showing a TFT substrate of a liquid crystal device according to a third embodiment of the present invention. The configuration of the liquid crystal device of this embodiment differs from the above-mentioned liquid crystal device of the first embodiment shown in FIGS. 1 to 7 and the liquid crystal device of the second embodiment shown in FIGS. 8 and 9 . It is a configuration in which the alignment film 16 and the insulating film 60 are tightly bonded by using a transparent conductive film and grooves. Therefore, only the point of difference will be described, and the same reference numerals will be assigned to the same configurations as those of the first embodiment and the second embodiment, and descriptions thereof will be omitted.
[0172] As shown in FIG. 16, on the surface 60t of the insulating film 60 of the TFT substrate 310 that is the first substrate, the above-mentioned ...
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Abstract
Description
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