Multilayer wiring board capable of reducing noise over wide frequency band with simple structure
A technology for wiring boards and components, which is used in the cleaning/polishing of conductive patterns, printed circuits, including printed capacitors, etc., and can solve the problems of elimination, the total number of layers, and the inability to fully realize the miniaturization of circuit boards.
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no. 1 example 〕
[0038] Fig. 3 is a perspective view of a multilayer wiring board according to a first embodiment of the present invention.
[0039] The multilayer wiring board 10 includes low-capacitance layers 111 and 112 made of an insulating material generally used in circuit boards and having the same low capacitance between conductive layers, and two layers each having a higher than The high-capacitance layers 121 and 122 of the capacitance of each of the low-capacitance layers 111 and 112 .
[0040] Low-capacitance layers 111 and 112 are respectively arranged on the rear surface of multilayer wiring board 10 and the front surface thereof on which electronic components 60 such as LSI chips are mounted.
[0041] The high capacitance layers 121 and 122 have mutually different capacitances and are arranged adjacent to each other.
[0042] 4 is a cross-sectional view of the multilayer wiring board taken along line 4-4 in FIG. 3 .
[0043]Conductive layers arranged on the low-capacitance la...
no. 2 example
[0072] Now, referring to FIG. 8, a multilayer wiring board according to a second embodiment of the present invention will be described in which three different high-capacitance layers are combined.
[0073] Fig. 8 is a sectional view of a multilayer wiring board according to a second embodiment of the present invention.
[0074] The multilayer wiring board 20 includes low-capacitance layers 111 and 112 and three high-capacitance layers 121, 122 and 123, which are made of insulating materials commonly used in circuit boards and have a relatively low dielectric constant, And each sandwiched between conductive layers, the high-capacitance layers each have a higher capacitance than each of the low-capacitance layers 111 and 112 .
[0075] The low-capacitance layers 111 and 112 are respectively arranged on the rear surface of the multilayer wiring board 20 and the front surface thereof on which the electronic component 60 such as an LSI chip is mounted.
[0076] The high capacitan...
no. 3 example
[0099] Fig. 10 is a sectional view of a multilayer wiring board according to a third embodiment of the present invention.
[0100] The third embodiment of the present invention has such a structure that the power supply layer and the ground layer in the first embodiment as shown in FIG. 4 are replaced by the ground layer and the power supply layer, respectively. Therefore, the same symbols are assigned to elements in FIG. 10 that are the same as or equivalent to those in the first embodiment, and thus detailed explanations thereof are omitted.
[0101] 10, in the multilayer wiring board 30 according to the third embodiment of the present invention, the low capacitance layer 111, the first power supply layer 15, the high capacitance layer 121, the ground layer 14, the high capacitance layer 122, the second power supply layer 16 , and the low-capacitance layer 112 are stacked between the signal layers 131 and 132 from the bottom in the mentioned order.
[0102] Low-capacitance ...
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Abstract
Description
Claims
Application Information
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