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Laser processing method

A laser processing method and technology for processing objects, applied in metal processing, stone processing equipment, laser welding equipment, etc.

Active Publication Date: 2007-07-04
HAMAMATSU PHOTONICS KK
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In this way, it can be said that when the object to be processed is cut into a grid pattern by forming the modified region in the above-mentioned order, there is still room for improvement in the cutting accuracy.

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Embodiment Construction

[0066] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the laser processing method of the present embodiment, a phenomenon called multiphoton absorption is utilized in order to form a modified region inside the object to be processed. Therefore, first, a laser processing method for forming a modified region using multiphoton absorption will be described.

[0067] The band gap (band gap) E G When it is still young, it becomes optically transparent. Therefore, the condition for absorption on the material is hv>E G . However, even if it is optically transparent, if the intensity of the laser is increased very much, then nhv>E G Absorption occurs on the material under the conditions (n=2, 3, 4, ...). This phenomenon is called multiphoton absorption. In the case of pulsed waves, the intensity of the laser is determined by the peak power density (W / cm 2 ) determined, for example, at a peak power densit...

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Abstract

A laser processing method enabling highly accurate cutting of an object to be processed. In the laser processing method, laser light (L) is irradiated with a light concentration point (P) set at the inside of a plate-like object (1) to be processed. First, a first reforming region (71) as a start point of cutting is formed along a first to-be-cut line (5a) of the object (1). Then, a second reforming region (72) as a start point of cutting is formed along a second to-be-cut line (5b), intersecting with the to-be-cut line (5a), so as to intersects with at least a portion of the reforming region (71). After that, a fourth reforming region (73) as a start point of cutting is formed along the to-be-cut line (5b). Then, a third reforming region (74) as a start point of cutting is formed along the to-be-cut line (5a) so as to intersect with at least a portion of the reforming region (73), the third reforming region (74) being formed between the reforming region (71) and an incident surface (1a) of the object (1), into which incident surface (1a) the laser light (L) enters.

Description

technical field [0001] The present invention relates to a laser processing method used for cutting a plate-shaped object to be processed. Background technique [0002] In the prior art of this kind, there is a laser processing method in which a modified region along a line to be cut is formed inside the object to be processed by aligning a focal point with the inside of the object to be processed and irradiating laser light. multiple rows, and the modified region is used as the starting point of cutting (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2002-205180 [0004] In the case where the plate-shaped object to be processed is cut into a lattice using the above-mentioned laser processing method, for example, as shown in FIG. 20(A) and FIG. 20(B), modified area. 20(A) and 20(B) are schematic diagrams illustrating an example of the procedure for forming modified regions 171, 172 inside the object 101, and FIG. 21 is a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/40B23K26/00B23K26/06B28D5/00B23K26/064B23K26/38
CPCB23K26/38B23K26/0057B23K26/4075B23K2201/40B23K26/40B23K26/53B23K2101/40B23K2103/50B23K26/06
Inventor 坂本刚志
Owner HAMAMATSU PHOTONICS KK
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